Inventor · disambiguated record
Somnath Ghosh
Also filed as: GHOSH SOMNATH
42 granted patents·15 pending applications·97 citations·filing 2001–2024
96Inventor score
Top patents by PatentIndex Score
57 records- 0194US12444653B2Buried power rail at tight cell-to-cell spaceIBM·Filed 2021·Granted Oct 14, 2025·2 cites·14 claims
- 0294US11372383B1Healthy building dashboard facilitated by hierarchical model of building control assetsHONEYWELL INT INC·Filed 2021·Granted Jun 28, 2022·7 cites·20 claims
- 0393US12268031B2Backside power rails and power distribution network for density scalingIBM·Filed 2021·Granted Apr 1, 2025·2 cites·12 claims
- 0487US11990412B2Buried power rails located in a base layer including first, second, and third etch stop layersIBM·Filed 2021·Granted May 21, 2024·1 cites·6 claims
- 0587US10998193B1Spacer-assisted lithographic double patterningIBM·Filed 2020·Granted May 4, 2021·2 cites·17 claims
- 0685US12394660B2Buried power rail after replacement metal gateIBM·Filed 2021·Granted Aug 19, 2025·1 cites·17 claims
- 0782US11682617B2High aspect ratio vias for integrated circuitsIBM·Filed 2020·Granted Jun 20, 2023·1 cites·20 claims
- 0882US7702856B2Dynamic prefetch distance calculationINTEL CORP·Filed 2005·Granted Apr 20, 2010·13 cites·12 claims
- 0981US10818494B2Metal on metal multiple patterningGLOBALFOUNDRIES INC·Filed 2018·Granted Oct 27, 2020·2 cites·20 claims
- 1081US6721943B2Compile-time memory coalescing for dynamic arraysINTEL CORP·Filed 2001·Granted Apr 13, 2004·33 cites·30 claims
- 1180US11815865B2Healthy building dashboard facilitated by hierarchical model of building control assetsHONEYWELL INT INC·Filed 2023·Granted Nov 14, 2023·0 cites·20 claims
- 1278US12111624B2Healthy building dashboard facilitated by hierarchical model of building control assetsHONEYWELL INT INC·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 1378US11139201B2Top via with hybrid metallizationIBM·Filed 2019·Granted Oct 5, 2021·2 cites·19 claims
- 1476US12148833B2Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a waferIBM·Filed 2023·Granted Nov 19, 2024·0 cites·11 claims
- 1574US10083958B2Deep trench metal-insulator-metal capacitorsGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 25, 2018·2 cites·19 claims
- 1673US6880154B2Alias-free test for dynamic array structuresINTEL CORP·Filed 2001·Granted Apr 12, 2005·19 cites·27 claims
- 1772US11599075B2Healthy building dashboard facilitated by hierarchical model of building control assetsHONEYWELL INT INC·Filed 2022·Granted Mar 7, 2023·0 cites·20 claims
- 1872US11004736B2Integrated circuit having a single damascene wiring networkIBM·Filed 2019·Granted May 11, 2021·1 cites·14 claims
- 1971US10510675B2Substrate structure with spatial arrangement configured for coupling of surface plasmons to incident lightGLOBALFOUNDRIES INC·Filed 2018·Granted Dec 17, 2019·2 cites·7 claims
- 2070US11854884B2Fully aligned top viasIBM·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2167US11398378B2Metal on metal multiple patterningGLOBALFOUNDRIES INC·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 2267US10552934B2Reducing memory latency in graphics operationsINTEL CORP·Filed 2016·Granted Feb 4, 2020·2 cites·25 claims
- 2367US9298933B2Autonomous role-based security for database management systemsGOEL ANIL·Filed 2013·Granted Mar 29, 2016·3 cites·18 claims
- 2465US11817501B2Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a waferIBM·Filed 2021·Granted Nov 14, 2023·0 cites·12 claims
- 2565US9049189B2Multi-control password changingGOEL ANIL·Filed 2012·Granted Jun 2, 2015·2 cites·20 claims
- 2664US11270913B2BEOL metallization formationIBM·Filed 2020·Granted Mar 8, 2022·0 cites·18 claims
- 2764US2022189826A1Beol metallization formationIBM·Filed 2022·Application pending·0 cites
- 2861US11688636B2Spin on scaffold film for forming topviaIBM·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 2960US11217481B2Fully aligned top viasIBM·Filed 2019·Granted Jan 4, 2022·0 cites·14 claims
- 3059US12020949B2Subtractive patterning of interconnect structuresIBM·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 3156US2024203881A1Dielectric separation for backside power rail linesIBM·Filed 2022·Application pending·0 cites
- 3256US2024203780A1Dielectric filled alignment mark structuresIBM·Filed 2022·Application pending·0 cites
- 3355US12046511B2Selective metal residue and liner cleanse for post-subtractive etchIBM·Filed 2021·Granted Jul 23, 2024·0 cites·11 claims
- 3455US2024162087A1Mandrel-pull-first interconnect patterningIBM·Filed 2022·Application pending·0 cites
- 3554US2023402318A1Via connection to backside power delivery networkIBM·Filed 2022·Application pending·0 cites
- 3654US2023411289A1Self-aligned backside contact with increased contact areaIBM·Filed 2022·Application pending·0 cites
- 3753US12400871B2Metal lines with low via-to-via spacingIBM·Filed 2020·Granted Aug 26, 2025·0 cites·16 claims
- 3853US2025265924A1Method and system for generating configuration parameters for a security systemHONEYWELL INT INC·Filed 2024·Application pending·0 cites
- 3953US2024419882A1Selective cuts to remove predicted interconnect bulging regionsIBM·Filed 2023·Application pending·0 cites
- 4053US2023299000A1Method and structure for forming landing for backside power distribution networkIBM·Filed 2022·Application pending·0 cites
- 4152US2023253322A1Nano-tsv landing over buried power railIBM·Filed 2022·Application pending·0 cites
- 4251US11024551B1Metal replacement vertical interconnections for buried capacitanceIBM·Filed 2020·Granted Jun 1, 2021·0 cites·20 claims
- 4351US2023154783A1Replacement buried power railIBM·Filed 2021·Application pending·0 cites
- 4450US11830778B2Back-side wafer modificationIBM·Filed 2020·Granted Nov 28, 2023·0 cites·10 claims
- 4550US11244897B2Back end of line metallizationIBM·Filed 2020·Granted Feb 8, 2022·0 cites·14 claims
- 4648US11527434B2Line cut patterning using sacrificial materialIBM·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 4748US11302571B2Cut integration for subtractive first metal line with bottom up second metal lineIBM·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 4848US11158536B2Patterning line cuts before line patterning using sacrificial fill materialIBM·Filed 2020·Granted Oct 26, 2021·0 cites·20 claims
- 4948US11062943B2Top via interconnects with wrap around linerIBM·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 5048US2024420479A1Method and system for testing video analytics of a video surveillance systemHONEYWELL INT INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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