Inventor · disambiguated record
Songyun Kang
Also filed as: KANG SONGYUN
7 granted patents·21 pending applications·20 citations·filing 2005–2025
78Inventor score
Top patents by PatentIndex Score
28 records- 0187US8636871B2Plasma processing apparatus, plasma processing method and storage mediumSAWADA IKUO·Filed 2007·Granted Jan 28, 2014·14 cites·18 claims
- 0284US2025360595A1Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0377US12415248B2Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·18 claims
- 0472US9252001B2Plasma processing apparatus, plasma processing method and storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted Feb 2, 2016·2 cites·4 claims
- 0565US2025054735A1Edge ring and apparatus for processing a substrate including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0665US2025234502A1Semiconductor devices including contact plug and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0764US8945413B2Etching method, etching apparatus, and ring memberSUZUKI AYUTA·Filed 2012·Granted Feb 3, 2015·2 cites·14 claims
- 0863US8419960B2Plasma processing apparatus and methodSAWADA IKUO·Filed 2009·Granted Apr 16, 2013·2 cites·20 claims
- 0962US2025204262A1Reactive ion beam etchingSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1062US2025273484A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1162US2025232986A1Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1260US2025299967A1Method of manufacturing semiconductor device and semiconductor devices produced by such methodsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1359US12394640B2Apparatus for cleaning waferSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1459US2025183005A1Substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1559US2025194110A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1658US2024148133A1Brush for cleaning a waferSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1758US2024395501A1Inductively coupled plasma processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1857US2025379038A1Plasma etching apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1956US2025218843A1Substrate holding unit and substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2054US2024162014A1Process chamber, substrate treating apparatus including the same, and operating method of the substrate treating apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2153US2024162017A1Substrate supporting device, a substrate processing apparatus including the same, and a substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2252US2011240222A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 2351US2025022693A1Electrostatic chucks and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2451US2025140568A1Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2548US2010307684A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2645US2025054733A1Apparatus for processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2744US9441292B2Etching method, etching apparatus, and ring memberTOKYO ELECTRON LTD·Filed 2015·Granted Sep 13, 2016·0 cites·1 claims
- 2840US2008311313A1Film Forming Method and Film Forming ApparatusTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →