Inventor · disambiguated record
Sonja Koller
Also filed as: KOLLER SONJA
24 granted patents·20 pending applications·15 citations·filing 2014–2023
91Inventor score
Top patents by PatentIndex Score
44 records- 0177US11134573B2Printed wiring-board islands for connecting chip packages and methods of assembling sameINTEL CORP·Filed 2017·Granted Sep 28, 2021·2 cites·23 claims
- 0276US11784143B2Single metal cavity antenna in package connected to an integrated transceiver front-endINTEL CORP·Filed 2019·Granted Oct 10, 2023·2 cites·15 claims
- 0376US9368461B2Contact pads for integrated circuit packagesINTEL CORP·Filed 2014·Granted Jun 14, 2016·4 cites·23 claims
- 0475US11646498B2Package integrated cavity resonator antennaINTEL CORP·Filed 2019·Granted May 9, 2023·2 cites·16 claims
- 0573US10629731B2Power mesh-on-die trace bumpingINTEL IP CORP·Filed 2019·Granted Apr 21, 2020·1 cites·19 claims
- 0673US9397019B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2014·Granted Jul 19, 2016·2 cites·14 claims
- 0769US11877403B2Printed wiring-board islands for connecting chip packages and methods of assembling sameINTEL CORP·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 0869US10263106B2Power mesh-on-die trace bumpingINTEL IP CORP·Filed 2017·Granted Apr 16, 2019·1 cites·21 claims
- 0965US2022294115A1Patch antennas stitched to systems in packages and methods of assembling sameINTEL CORP·Filed 2022·Application pending·0 cites
- 1064US10651102B2Interposer with conductive routing exposed on sidewallsINTEL IP CORP·Filed 2015·Granted May 12, 2020·1 cites·11 claims
- 1158US2025201761A1Self-aligning semiconductor constructionINTEL CORP·Filed 2023·Application pending·0 cites
- 1257US9921694B2Wearable computing deviceINTEL CORP·Filed 2014·Granted Mar 20, 2018·0 cites·4 claims
- 1355US2025201605A1Assembly and method for preventing warpage in a semiconductor packageINTEL CORP·Filed 2023·Application pending·0 cites
- 1455US2025201622A1Support structures for semiconductor substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1554US10373844B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2017·Granted Aug 6, 2019·0 cites·4 claims
- 1654US9653324B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2016·Granted May 16, 2017·0 cites·7 claims
- 1754US2025210456A1Active Cooling for Heterogenous PackagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1853US2018150156A1Wearable computing deviceINTEL CORP·Filed 2018·Application pending·0 cites
- 1951US11374323B2Patch antennas stitched to systems in packages and methods of assembling sameINTEL CORP·Filed 2017·Granted Jun 28, 2022·0 cites·15 claims
- 2051US10658201B2Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor deviceINTEL IP CORP·Filed 2018·Granted May 19, 2020·0 cites·19 claims
- 2150US2023282546A1Packaging architecture with active coolingWAIDHAS BERND·Filed 2022·Application pending·0 cites
- 2249US11456116B2Magnetic coils in locally thinned silicon bridges and methods of assembling sameINTEL CORP·Filed 2017·Granted Sep 27, 2022·0 cites·18 claims
- 2349US2023317544A1Integrated circuit packages having reduced z-height and heat pathINTEL CORP·Filed 2022·Application pending·0 cites
- 2449US2023300975A1Integrated circuit packages having reduced z-heightINTEL CORP·Filed 2022·Application pending·0 cites
- 2548US11410908B2Integrated circuit devices with front-end metal structuresINTEL IP CORP·Filed 2018·Granted Aug 9, 2022·0 cites·22 claims
- 2648US2023317681A1Three-dimensional stack cooling wingsINTEL CORP·Filed 2022·Application pending·0 cites
- 2748US2023317551A1Heterogeneous packages having thermal towersINTEL CORP·Filed 2022·Application pending·0 cites
- 2847US10091866B2Device with switchable heat pathINTEL IP CORP·Filed 2016·Granted Oct 2, 2018·0 cites·20 claims
- 2947US2023299043A1Packaging architecture with thermally conductive integrated circuit bridgeINTEL CORP·Filed 2022·Application pending·0 cites
- 3046US11145577B2Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatusINTEL IP CORP·Filed 2016·Granted Oct 12, 2021·0 cites·20 claims
- 3146US2023282615A1Stacked die packaging architecture with conductive vias on interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 3244US11037855B2Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatusINTEL IP CORP·Filed 2016·Granted Jun 15, 2021·0 cites·11 claims
- 3342US11764187B2Semiconductor packages, and methods for forming semiconductor packagesINTEL CORP·Filed 2017·Granted Sep 19, 2023·0 cites·14 claims
- 3441US2019004083A1Smart accelerometer cantileverINTELL IP CORP·Filed 2017·Application pending·0 cites
- 3540US10535578B2Semiconductor devices, and a method for forming a semiconductor deviceINTEL IP CORP·Filed 2017·Granted Jan 14, 2020·0 cites·19 claims
- 3640US10121726B2Cooler for semiconductor devicesINTEL IP CORP·Filed 2015·Granted Nov 6, 2018·0 cites·23 claims
- 3739US12249553B2Thermal contacts at periphery of integrated circuit packagesINTEL IP CORP·Filed 2018·Granted Mar 11, 2025·0 cites·25 claims
- 3838US2019206777A1Interposer with angled viasINTEL IP CORP·Filed 2017·Application pending·0 cites
- 3938US2019198448A1Anisotropically conductive elastic adhesive films in semiconductor device packages and methods of assembling sameINTEL IP CORP·Filed 2017·Application pending·0 cites
- 4038US2019297758A1Electromagnetic shielding cap, an electrical system and a method for forming an electromagnetic shielding capINTEL IP CORP·Filed 2018·Application pending·0 cites
- 4138US2019214327A1Thermal conduction devices and methods for embedded electronic devicesKOLLER SONJA·Filed 2018·Application pending·0 cites
- 4237US10347558B2Low thermal resistance hanging die packageINTEL IP CORP·Filed 2015·Granted Jul 9, 2019·0 cites·15 claims
- 4335US2017178999A1Flip-chip package with thermal dissipation layerINTEL IP CORP·Filed 2015·Application pending·0 cites
- 4434US2018284851A1Filler interface heat transfer system and devices and methods for sameSEIDEMANN GEORG·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sonja Koller files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →