Inventor · disambiguated record
Sooryong Lee
Also filed as: LEE SOORYONG
6 granted patents·2 pending applications·9 citations·filing 2009–2022
72Inventor score
Top patents by PatentIndex Score
8 records- 0184US12354920B2Method of forming optical proximity correction model and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·1 cites·20 claims
- 0281US10620547B2Method for correcting a mask layout and method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·3 cites·20 claims
- 0374US7979812B2Method and apparatus for correcting assist-feature-printing errors in a layoutSYNOPSYS INC·Filed 2009·Granted Jul 12, 2011·5 cites·26 claims
- 0459US12299869B2Computing device for predicting a profile using deep learning and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·19 claims
- 0556US12361537B2Electronic device including processor executing defect detection module, operating method of electronic device, and method for fabricating semiconductor integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0653US12229944B2Defect detection method of deep learning-based semiconductor device and semiconductor element manufacturing method including the defect detection methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 0750US2023197460A1Image-based semiconductor device patterning method using deep neural networkSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0845US2023280646A1Corner rounding method of opc pattern based on deep learning, and opc method and mask manufacturing method including the corner rounding methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sooryong Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →