Inventor · disambiguated record
Soo Park
Also filed as: PARK SOO BOK · PARK SOO G
1 granted patent·3 pending applications·5 citations·filing 2005–2007
25Inventor score
Top patents by PatentIndex Score
4 records- 0163US7810695B2Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tipAMKOR TECHNOLOGY INC·Filed 2005·Granted Oct 12, 2010·5 cites·18 claims
- 0236US2006237855A1Substrate for producing a soldering connection to a second substrateKROEHNERT STEFFEN·Filed 2006·Application pending·0 cites
- 0335US2006270109A1Manufacturing method for an electronic component assembly and corresponding electronic component assemblyBLASZCZAK STEPHAN·Filed 2005·Application pending·0 cites
- 0433US2007216038A1Method for producing semiconductor componentsPARK SOO G·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →