Inventor · disambiguated record
Soojae Park
Also filed as: PARK SOOJAE
17 granted patents·4 pending applications·50 citations·filing 2007–2023
91Inventor score
Top patents by PatentIndex Score
21 records- 0191US12080479B2Chip capacitor including capacitor wiresSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 3, 2024·1 cites·20 claims
- 0283US9402315B2Semiconductor package having magnetic connection memberSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 26, 2016·7 cites·5 claims
- 0383US9391009B2Semiconductor packages including heat exhaust partJANG EON SOO·Filed 2014·Granted Jul 12, 2016·10 cites·19 claims
- 0483US8269340B2Curvilinear heat spreader/lid with improved heat dissipationGAYNES MICHAEL A·Filed 2007·Granted Sep 18, 2012·10 cites·13 claims
- 0578US8352230B2Integrated framework for finite-element methods for package, device and circuit co-designIBM·Filed 2010·Granted Jan 8, 2013·5 cites·19 claims
- 0678US7516674B1Method and apparatus for thermally induced testing of materials under transient temperatureIBM·Filed 2008·Granted Apr 14, 2009·5 cites·1 claims
- 0776US9397052B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 19, 2016·4 cites·17 claims
- 0875US9960107B2Package substrate, method for fabricating the same, and package device including the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 1, 2018·2 cites·20 claims
- 0971US10147616B2Package frame and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 4, 2018·3 cites·17 claims
- 1070US10134666B2Package substrate, method for fabricating the same, and package device including the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 20, 2018·1 cites·20 claims
- 1162US8877566B2Curvilinear heat spreader/lid with improved heat dissipationGAYNES MICHAEL A·Filed 2012·Granted Nov 4, 2014·1 cites·12 claims
- 1260US12451291B2Capacitor wire and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·21 claims
- 1360US12267962B2Capacitor-wire-embedded wiring boardSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1455US2024006122A1Capacitor wire and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1554US11315803B2Stress mitigation in organic laminatesIBM·Filed 2020·Granted Apr 26, 2022·0 cites·22 claims
- 1654US2024021663A1Wire structure, wire capacitor including wire structure, and electronic device including wire capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1751US9393633B2Method of joining a chip on a substrateBLAIS PASCAL P·Filed 2009·Granted Jul 19, 2016·1 cites·18 claims
- 1848US11508681B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·18 claims
- 1948US10777495B2Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 15, 2020·0 cites·17 claims
- 2040US2012292375A1Method of joining a chip on a substrateBLAIS PASCAL P·Filed 2012·Application pending·0 cites
- 2135US2016329275A1Package substrate and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Soojae Park files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →