Inventor · disambiguated record
Soichi Yoshida
Also filed as: YOSHIDA SOICHI
28 granted patents·14 pending applications·10 citations·filing 2005–2025
93Inventor score
Top patents by PatentIndex Score
42 records- 0188US11049785B2Semiconductor device and fabrication method thereofFUJI ELECTRIC CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·7 claims
- 0287US11257943B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Feb 22, 2022·2 cites·17 claims
- 0385US12218024B2Semiconductor device and fabrication method thereofFUJI ELECTRIC CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·14 claims
- 0480US12477815B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·29 claims
- 0580US12237408B2Semiconductor device and production methodFUJI ELECTRIC CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0680US11239234B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Feb 1, 2022·2 cites·18 claims
- 0780US11043555B2Semiconductor device and manufacturing method of the sameFUJI ELECTRIC CO LTD·Filed 2018·Granted Jun 22, 2021·2 cites·17 claims
- 0879US12015058B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·17 claims
- 0979US2025098192A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1078US12009268B2Semiconductor device and fabrication method for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 1178US2024332373A1Semiconductor device and manufacturing methodFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1277US2025183112A1Semiconductor device and fabrication method thereofFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 1376US11742249B2Semiconductor device and fabrication method for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·7 claims
- 1475US12068404B2Semiconductor device and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 1575US2025194126A1Semiconductor device and production methodFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 1674US11830782B2Semiconductor device and fabrication method thereofFUJI ELECTRIC CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·11 claims
- 1772US11810914B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·4 claims
- 1871US12159928B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·20 claims
- 1971US10770456B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Sep 8, 2020·1 cites·17 claims
- 2070US12094960B2Semiconductor device and systemFUJI ELECTRIC CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 2170US11715771B2Semiconductor device and manufacturing methodFUJI ELECTRIC CO LTD·Filed 2020·Granted Aug 1, 2023·0 cites·16 claims
- 2269US11955540B2Semiconductor device and production methodFUJI ELECTRIC CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 2369US2025267928A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2466US12426289B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 2566US11777020B2Semiconductor device and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·29 claims
- 2666US11450734B2Semiconductor device and fabrication method for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·34 claims
- 2764US2025089351A1Semiconductor device and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 2863US12302629B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted May 13, 2025·0 cites·17 claims
- 2963US11552165B2Semiconductor device and manufacturing method of 1HE sameFUJI ELECTRIC CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·8 claims
- 3063US2025022710A1Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 3162US12142538B2Fabrication method of semiconductor device and test method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 3261US2024363623A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 3360US2025331209A1Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 3460US2025318253A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 3559US2025316551A1Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 3658US2024243191A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 3755US12205948B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·25 claims
- 3855US11322605B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted May 3, 2022·0 cites·20 claims
- 3955US2023299078A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 4051US11424351B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Aug 23, 2022·0 cites·10 claims
- 4145US2008177002A1Thermoplastic Resin Composition, Optical Film, And Process For Producing FilmJSR CORP·Filed 2005·Application pending·0 cites
- 4237US8171676B2Construction of nuclear power plant building and construction method thereofYOSHIDA SOICHI·Filed 2010·Granted May 8, 2012·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →