Inventor · disambiguated record
Soeren Zenner
Also filed as: ZENNER SOEREN
1 granted patent·1 pending application·0 citations·filing 2010–2011
5Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0132US8384218B2Back side metallization with superior adhesion in high-performance semiconductor devicesGLOBALFOUNDRIES INC·Filed 2010·Granted Feb 26, 2013·0 cites·23 claims
- 0229US2012052677A1Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma ProcessZENNER SOEREN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →