Inventor · disambiguated record
Sriskantharajah Thirunavukarasu
Also filed as: THIRUNAVUKARASU SRISKANTHARAJAH
36 granted patents·12 pending applications·37 citations·filing 2012–2024
95Inventor score
Top patents by PatentIndex Score
48 records- 0190US11053590B2Nozzle for uniform plasma processingAPPLIED MATERIALS INC·Filed 2019·Granted Jul 6, 2021·3 cites·10 claims
- 0287US10465288B2Nozzle for uniform plasma processingAPPLIED MATERIALS INC·Filed 2014·Granted Nov 5, 2019·4 cites·10 claims
- 0382US10446423B2Next generation warpage measurement systemAPPLIED MATERIALS INC·Filed 2017·Granted Oct 15, 2019·4 cites·20 claims
- 0479US10903055B2Edge ring for bevel polymer reductionAPPLIED MATERIALS INC·Filed 2015·Granted Jan 26, 2021·4 cites·9 claims
- 0579US10784134B2Image based substrate mapperAPPLIED MATERIALS INC·Filed 2018·Granted Sep 22, 2020·2 cites·18 claims
- 0679US10325790B2Methods and apparatus for correcting substrate deformityAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·3 cites·20 claims
- 0777US9845533B2Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneityAPPLIED MATERIALS INC·Filed 2014·Granted Dec 19, 2017·3 cites·9 claims
- 0876US12437999B2Methods and apparatus for mask patterning debris removalAPPLIED MATERIALS INC·Filed 2024·Granted Oct 7, 2025·0 cites·12 claims
- 0976US9595464B2Apparatus and method for reducing substrate sliding in process chambersAPPLIED MATERIALS INC·Filed 2015·Granted Mar 14, 2017·2 cites·13 claims
- 1075US10504762B2Bridging front opening unified pod (FOUP)APPLIED MATERIALS INC·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 1174US9478697B2Reusable substrate carrierAPPLIED MATERIALS INC·Filed 2014·Granted Oct 25, 2016·3 cites·15 claims
- 1268US10930542B2Apparatus for handling various sized substratesAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·1 cites·19 claims
- 1368US10566226B2Multi-cassette carrying caseAPPLIED MATERIALS INC·Filed 2015·Granted Feb 18, 2020·1 cites·16 claims
- 1467US11421316B2Methods and apparatus for controlling warpage in wafer level packaging processesAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·1 cites·15 claims
- 1566US10153187B2Methods and apparatus for transferring a substrateAPPLIED MATERIALS INC·Filed 2015·Granted Dec 11, 2018·1 cites·19 claims
- 1666US2022246476A1Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1765US11309278B2Methods for bonding substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 19, 2022·1 cites·18 claims
- 1865US11177146B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2019·Granted Nov 16, 2021·1 cites·16 claims
- 1965US9818624B2Methods and apparatus for correcting substrate deformityAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·1 cites·20 claims
- 2063US12068159B2Methods and apparatus for mask patterning debris removalAPPLIED MATERIALS INC·Filed 2021·Granted Aug 20, 2024·0 cites·8 claims
- 2160US11342226B2Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2019·Granted May 24, 2022·0 cites·12 claims
- 2260US11302549B2Substrate vacuum transport and storage apparatusAPPLIED MATERIALS INC·Filed 2019·Granted Apr 12, 2022·0 cites·19 claims
- 2359US11739411B2Lattice coat surface enhancement for chamber componentsAPPLIED MATERIALS INC·Filed 2019·Granted Aug 29, 2023·0 cites·14 claims
- 2458US9960023B2Methods and apparatus for nodule control in a titanium-tungsten targetAPPLIED MATERIALS INC·Filed 2014·Granted May 1, 2018·0 cites·16 claims
- 2557US9993853B2Method and apparatus for backside cleaning of substratesAPPLIED MATERIALS INC·Filed 2014·Granted Jun 12, 2018·0 cites·17 claims
- 2656US10154586B2Apparatus and method for solid state source array design and fabricationAPPLIED MATERIALS INC·Filed 2014·Granted Dec 11, 2018·0 cites·17 claims
- 2755US11721583B2Mainframe-less wafer transfer platform with linear transfer system for wafer processing modulesAPPLIED MATERIALS INC·Filed 2020·Granted Aug 8, 2023·0 cites·15 claims
- 2854US10549324B2Method and apparatus for backside cleaning of substratesAPPLIED MATERIALS INC·Filed 2018·Granted Feb 4, 2020·0 cites·10 claims
- 2954US10262877B2Apparatus and method for reducing substrate sliding in process chambersAPPLIED MATERIALS INC·Filed 2017·Granted Apr 16, 2019·0 cites·7 claims
- 3054US2019326147A1Multi-cassette carrying caseAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3151US11111583B2Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneityAPPLIED MATERIALS INC·Filed 2017·Granted Sep 7, 2021·0 cites·20 claims
- 3251US10347516B2Substrate transfer chamberAPPLIED MATERIALS INC·Filed 2015·Granted Jul 9, 2019·0 cites·21 claims
- 3350US2012237693A1In-situ clean process for metal deposition chambersJACKSON MICHAEL·Filed 2012·Application pending·0 cites
- 3447US10847400B2Adhesive-less substrate bonding to carrier plateAPPLIED MATERIALS INC·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 3546US2018281151A1Adhesive-less carriers for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3645US10607870B2Substrate carrier for active/passive bonding and de-bonding of a substrateAPPLIED MATERIALS INC·Filed 2016·Granted Mar 31, 2020·0 cites·17 claims
- 3745US2022108908A1Shadow ring kit for plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3843US2015332942A1Pedestal fluid-based thermal controlPEH ENG SHENG·Filed 2014·Application pending·0 cites
- 3942US11871667B2Methods and apparatus for warpage correctionAPPLIED MATERIALS INC·Filed 2020·Granted Jan 9, 2024·0 cites·17 claims
- 4040US10777442B2Hybrid substrate carrierAPPLIED MATERIALS INC·Filed 2017·Granted Sep 15, 2020·0 cites·19 claims
- 4139US10978334B2Sealing structure for workpiece to substrate bonding in a processing chamberAPPLIED MATERIALS INC·Filed 2015·Granted Apr 13, 2021·0 cites·18 claims
- 4239US9740111B2Electrostatic carrier for handling substrates for processingSUNDARRAJAN ARVIND·Filed 2014·Granted Aug 22, 2017·0 cites·20 claims
- 4339US2021057238A1Methods and apparatus for contactless substrate warpage correctionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4438US2021035795A1Methods and apparatus for substrate warpage correctionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4536US2020306931A1Methods and apparatus for removing abrasive particlesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4636US2019259647A1Deposition ring for processing reduced size substratesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4736US2019259635A1Process kit for processing reduced sized substratesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4831US2016236245A1Self-cleaning substrate contact surfacesAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →