Inventor · disambiguated record
Stephen H. Black
Also filed as: BLACK STEPHEN H · BLACK STEPHEN HOLDEN
36 granted patents·4 pending applications·171 citations·filing 1990–2023
96Inventor score
Top patents by PatentIndex Score
40 records- 0191US9570321B1Use of an external getter to reduce package pressureRAYTHEON CO·Filed 2015·Granted Feb 14, 2017·6 cites·20 claims
- 0289US8736045B1Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2012·Granted May 27, 2014·8 cites·6 claims
- 0387US8608894B2Wafer level packaged focal plane arrayBLACK STEPHEN H·Filed 2011·Granted Dec 17, 2013·5 cites·18 claims
- 0486US6885002B1IRFPA ROIC with dual TDM reset integrators and sub-frame averaging functions per unit cellRAYTHEON CO·Filed 2001·Granted Apr 26, 2005·33 cites·21 claims
- 0585US8809784B2Incident radiation detector packagingGOOCH ROLAND W·Filed 2011·Granted Aug 19, 2014·11 cites·20 claims
- 0682US9093444B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2013·Granted Jul 28, 2015·4 cites·6 claims
- 0780US8511823B2Imaging systemBLACK STEPHEN H·Filed 2011·Granted Aug 20, 2013·5 cites·18 claims
- 0879US8044355B2System and method for viewing an area using an optical system positioned inside of a dewarRAYTHEON CO·Filed 2007·Granted Oct 25, 2011·9 cites·17 claims
- 0978US9427776B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2012·Granted Aug 30, 2016·1 cites·11 claims
- 1073US9334154B2Hermetically sealed package having stress reducing layerRAYTHEON CO·Filed 2014·Granted May 10, 2016·2 cites·22 claims
- 1173US8586926B2Antenna-coupled antenna arraysBLACK STEPHEN H·Filed 2011·Granted Nov 19, 2013·1 cites·19 claims
- 1273US8294103B2System and method for viewing an area using an optical system positioned inside of a dewarGIBBONS ROBERT C·Filed 2011·Granted Oct 23, 2012·3 cites·21 claims
- 1371US12192658B2Interface circuit for photodetectors providing full-frame integration and pixel-level digitizationNU TREK INC·Filed 2023·Granted Jan 7, 2025·0 cites·19 claims
- 1471US12155951B2Interface circuit for photodetectors providing full-frame integration and pixel-level digitizationNU TREK INC·Filed 2023·Granted Nov 26, 2024·0 cites·18 claims
- 1571US6344651B1Differential current mode output circuit for electro-optical sensor arraysINDIGO SYSTEMS CORP·Filed 1999·Granted Feb 5, 2002·38 cites·20 claims
- 1670US9227839B2Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave couplingRAYTHEON CO·Filed 2014·Granted Jan 5, 2016·2 cites·14 claims
- 1768US8980676B2Fabrication of window cavity cap structures in wafer level packagingDIEP BUU·Filed 2012·Granted Mar 17, 2015·2 cites·16 claims
- 1866US9277142B2Infrared thermal imaging system and methodKUIKEN MATTHEW T·Filed 2012·Granted Mar 1, 2016·2 cites·16 claims
- 1966US9022584B2Protecting an optical surfaceBLACK STEPHEN H·Filed 2011·Granted May 5, 2015·2 cites·20 claims
- 2063US9407820B2Method and apparatus for inhibiting diversion of devices using an embedded accelerometerRAYTHEON CO·Filed 2013·Granted Aug 2, 2016·1 cites·18 claims
- 2160US8653467B2Multichip packaging for imaging systemBLACK STEPHEN H·Filed 2012·Granted Feb 18, 2014·1 cites·20 claims
- 2259US10262913B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2018·Granted Apr 16, 2019·0 cites·8 claims
- 2359US8884815B2Antenna-coupled imager having pixels with integrated lensletsGRITZ MICHAEL A·Filed 2011·Granted Nov 11, 2014·2 cites·18 claims
- 2458US9174836B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 3, 2015·0 cites·23 claims
- 2557US9187312B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 17, 2015·0 cites·15 claims
- 2656US10315918B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2016·Granted Jun 11, 2019·0 cites·18 claims
- 2756US9966320B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2016·Granted May 8, 2018·0 cites·5 claims
- 2856US9196556B2Getter structure and method for forming such structureRAYTHEON CO·Filed 2014·Granted Nov 24, 2015·0 cites·6 claims
- 2956US6133596ANear complete charge transfer deviceRAYTHEON CO·Filed 1999·Granted Oct 17, 2000·16 cites·21 claims
- 3054US9865519B2Use of an external getter to reduce package pressureRAYTHEON CO·Filed 2017·Granted Jan 9, 2018·0 cites·20 claims
- 3153US9520332B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2015·Granted Dec 13, 2016·0 cites·4 claims
- 3252US9708181B2Hermetically sealed package having stress reducing layerRAYTHEON CO·Filed 2016·Granted Jul 18, 2017·0 cites·4 claims
- 3348US6288387B1Apparatus and method for performing optical signal intensity correction in electro-optical sensor arraysRAYTHEON CO·Filed 1999·Granted Sep 11, 2001·12 cites·18 claims
- 3446US11985442B2Bias circuit with improved noise performanceNU TREK INC·Filed 2021·Granted May 14, 2024·0 cites·16 claims
- 3546US9105800B2Method of forming deposited patterns on a surfaceRAYTHEON CO·Filed 2013·Granted Aug 11, 2015·0 cites·3 claims
- 3646US2016040282A1Getter structure and method for forming such structureRAYTHEON CO·Filed 2015·Application pending·0 cites
- 3742US2014175590A1Getter structure for wafer level vacuum packaged deviceRAYTHEON CO·Filed 2012·Application pending·0 cites
- 3841US2013334635A1Pixel structure with reduced vacuum requirementsRAYTHEON CO·Filed 2012·Application pending·0 cites
- 3934US2012281113A1USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIPKENNEDY ADAM M·Filed 2011·Application pending·0 cites
- 4029US5051747AInterface for cablesCONTRAVES GOERZ CORP·Filed 1990·Granted Sep 24, 1991·5 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →