Inventor · disambiguated record
Steven H. Boettcher
Also filed as: BOETTCHER STEVEN H
9 granted patents·5 pending applications·163 citations·filing 1998–2022
88Inventor score
Top patents by PatentIndex Score
14 records- 0188US6123825AElectromigration-resistant copper microstructure and process of makingIBM·Filed 1998·Granted Sep 26, 2000·85 cites·25 claims
- 0279US6911229B2Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereofIBM·Filed 2002·Granted Jun 28, 2005·20 cites·14 claims
- 0377US6416812B1Method for depositing copper onto a barrier layerIBM·Filed 2000·Granted Jul 9, 2002·20 cites·18 claims
- 0474US6572982B1Electromigration-resistant copper microstructureIBM·Filed 2000·Granted Jun 3, 2003·15 cites·6 claims
- 0570US6383929B1Copper vias in low-k technologyIBM·Filed 2001·Granted May 7, 2002·17 cites·5 claims
- 0666US7560692B2Method of TEM sample preparation for electron holography for semiconductor devicesIBM·Filed 2006·Granted Jul 14, 2009·2 cites·10 claims
- 0762US12274966B2Filter device having multiple changeable filter surfacesIBM·Filed 2022·Granted Apr 15, 2025·0 cites·16 claims
- 0858US7214935B2Transmission electron microscopy sample preparation method for electron holographyIBM·Filed 2004·Granted May 8, 2007·3 cites·17 claims
- 0952US2008237053A1Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickelIBM·Filed 2008·Application pending·0 cites
- 1047US2005269708A1Tungsten encapsulated copper interconnections using electroplatingANDRICACOS PANAYOTIS C·Filed 2005·Application pending·0 cites
- 1144US7227265B2Electroplated copper interconnection structure, process for making and electroplating bathIBM·Filed 2004·Granted Jun 5, 2007·1 cites·21 claims
- 1243US2005006777A1Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereofIBM·Filed 2004·Application pending·0 cites
- 1340US2004108136A1Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickelIBM·Filed 2002·Application pending·0 cites
- 1439US2002092673A1Tungsten encapsulated copper interconnections using electroplatingIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →