Inventor · disambiguated record
Steven R. Boyle
Also filed as: BOYLE STEVEN · BOYLE STEVEN R
11 granted patents·316 citations·filing 1987–2008
92Inventor score
Top patents by PatentIndex Score
11 records- 0184US6996491B2Method and system for monitoring and profiling an integrated circuit die temperatureSUN MICROSYSTEMS INC·Filed 2002·Granted Feb 7, 2006·38 cites·29 claims
- 0284US6943436B2EMI heatspreader/lid for integrated circuit packagesSUN MICROSYSTEMS INC·Filed 2003·Granted Sep 13, 2005·35 cites·26 claims
- 0379US6893154B2Integrated temperature sensorSUN MICROSYSTEMS INC·Filed 2002·Granted May 17, 2005·27 cites·14 claims
- 0478US4990996ABonding pad schemeZILOG INC·Filed 1987·Granted Feb 5, 1991·56 cites·3 claims
- 0577US6573590B1Integrated circuit package with EMI containment featuresSUN MICROSYSTEMS INC·Filed 2002·Granted Jun 3, 2003·29 cites·18 claims
- 0675US7797596B2Method for monitoring and adjusting circuit performanceORACLE AMERICA INC·Filed 2007·Granted Sep 14, 2010·8 cites·14 claims
- 0775US5338970AMulti-layered integrated circuit package with improved high frequency performanceINTERGRAPH CORP·Filed 1993·Granted Aug 16, 1994·46 cites·11 claims
- 0872US7928744B2Monitoring circuit having a self test functionANALOG DEVICES INC·Filed 2008·Granted Apr 19, 2011·7 cites·13 claims
- 0970US6472900B1Efficient device debug systemSUN MICROSYSTEMS INC·Filed 2001·Granted Oct 29, 2002·16 cites·20 claims
- 1068US5499445AMethod of making a multi-layer to packageINTERGRAPH CORP·Filed 1994·Granted Mar 19, 1996·33 cites·6 claims
- 1157US6246252B1Efficient debug package designSUN MICROSYSTEMS INC·Filed 1999·Granted Jun 12, 2001·21 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →