Inventor · disambiguated record
Stephan Bradl
Also filed as: BRADL STEPHAN
20 granted patents·3 pending applications·164 citations·filing 1998–2020
93Inventor score
Files withINFINEON TECHNOLOGIES AG14BRADL STEPHAN2SIEMENS AG2BRUNNBAUER MARKUS1INTEL DEUTSCHLAND GMBH1
Top patents by PatentIndex Score
23 records- 0195US7906860B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 15, 2011·53 cites·18 claims
- 0293US9293423B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2014·Granted Mar 22, 2016·11 cites·15 claims
- 0393US7687895B2Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 30, 2010·30 cites·41 claims
- 0485US8309454B2Structure for electrostatic discharge in embedded wafer level packagesBRUNNBAUER MARKUS·Filed 2007·Granted Nov 13, 2012·10 cites·14 claims
- 0582US10566309B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 18, 2020·3 cites·25 claims
- 0675US6337255B1Method for forming a trench structure in a silicon substrateINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jan 8, 2002·25 cites·10 claims
- 0768US11652084B2Flat lead package formation methodINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·6 claims
- 0864US7911036B2Semiconductor wafer with rear side identification and methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·3 cites·11 claims
- 0962US11302668B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 12, 2022·0 cites·10 claims
- 1061US8173534B2Method for producing a semiconductor wafer with rear side identificationBRADL STEPHAN·Filed 2011·Granted May 8, 2012·2 cites·12 claims
- 1155US9601475B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL DEUTSCHLAND GMBH·Filed 2016·Granted Mar 21, 2017·0 cites·20 claims
- 1255US6447372B1Polishing agent for semiconductor substratesINFINEON TECHNOLOGIES AG·Filed 2000·Granted Sep 10, 2002·4 cites·8 claims
- 1351US6459296B2Method, system and method of using a component for setting the electrical characteristics of microelectronic circuit configurationsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 1, 2002·8 cites·13 claims
- 1449US8759230B2Treatment of a substrate with a liquid mediumBRADL STEPHAN·Filed 2008·Granted Jun 24, 2014·0 cites·22 claims
- 1548US7566378B2Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid mediumINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 28, 2009·0 cites·20 claims
- 1647US11410906B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 9, 2022·0 cites·16 claims
- 1747US7759792B2Integrated circuit including parylene material layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 20, 2010·0 cites·10 claims
- 1847US6014218ADevice and method for end-point monitoring used in the polishing of components, in particular semiconductor componentsSIEMENS AG·Filed 1998·Granted Jan 11, 2000·14 cites·22 claims
- 1946US2012058362A1Method for depositing metal on a substrate; metal structure and method for plating a metal on a substrateZISTLER MARKUS·Filed 2010·Application pending·0 cites
- 2037US7902062B2Electrodepositing a metal in integrated circuit applicationsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 8, 2011·0 cites·23 claims
- 2134US2011115096A1Electrodepositing a metal in integrated circuit applicationsINFINEON TECHNOLOGIES AG·Filed 2011·Application pending·0 cites
- 2234US2002072301A1Apparatus and method for detecting a work piece in an automatic processing apparatusFiled 2001·Application pending·0 cites
- 2324US6086269AMethod and apparatus for applying a substance to a surfaceSIEMENS AG·Filed 1998·Granted Jul 11, 2000·1 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →