Inventor · disambiguated record
Stefan Buhl
Also filed as: BUHL STEFAN
12 granted patents·1 pending application·15 citations·filing 2015–2022
83Inventor score
Top patents by PatentIndex Score
13 records- 0184US10234401B2Method of manufacturing semiconductor devices by using sampling plansQONIAC GMBH·Filed 2016·Granted Mar 19, 2019·8 cites·23 claims
- 0277US11092901B2Wafer exposure method using wafer models and wafer fabrication assemblyQONIAC GMBH·Filed 2020·Granted Aug 17, 2021·2 cites·20 claims
- 0374US10310490B2Method and apparatus of evaluating a semiconductor manufacturing processQONIAC GMBH·Filed 2016·Granted Jun 4, 2019·3 cites·10 claims
- 0468US10739685B2Process control method for lithographically processed semiconductor devicesQONIAC GMBH·Filed 2018·Granted Aug 11, 2020·1 cites·15 claims
- 0560US10008422B2Method for assessing the usability of an exposed and developed semiconductor waferQONIAC GMBH·Filed 2015·Granted Jun 26, 2018·1 cites·10 claims
- 0658US2025135869A1Vehicle with coupled cooling circuits for cooling an electrochemical cellMAN TRUCK & BUS SE·Filed 2022·Application pending·0 cites
- 0757US11434844B2Method for checking a variable valve lift control of an internal combustion engineVITESCO TECH GMBH·Filed 2019·Granted Sep 6, 2022·0 cites·7 claims
- 0855US11815050B2Device for supplying fuel and vehicle comprising a device of this typeMAN TRUCK & BUS SE·Filed 2021·Granted Nov 14, 2023·0 cites·18 claims
- 0952US11366397B2Method and apparatus for simulation of lithography overlayQONIAC GMBH·Filed 2019·Granted Jun 21, 2022·0 cites·8 claims
- 1049US11639017B2Lamella block with continuously varied lamella divisionKRAUSS MAFFEI TECH GMBH·Filed 2020·Granted May 2, 2023·0 cites·9 claims
- 1148US11590681B2Fin block with continuously varied fin widthKRAUSS MAFFEI TECH GMBH·Filed 2020·Granted Feb 28, 2023·0 cites·14 claims
- 1238US11181830B2Lithographic apparatus and method of controlling a lithographic apparatusQONIAC GMBH·Filed 2018·Granted Nov 23, 2021·0 cites·18 claims
- 1337US10699971B2Method for processing of a further layer on a semiconductor waferQONIAC GMBH·Filed 2018·Granted Jun 30, 2020·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →