Inventor · disambiguated record
Stanley Andrew Cejka
Also filed as: CEJKA STANLEY A · CEJKA STANLEY ANDREW
4 granted patents·4 citations·filing 2014–2019
60Inventor score
Top patents by PatentIndex Score
4 records- 0178US10256193B1Methods and devices with enhanced grounding and shielding for wire bond structuresNXP USA INC·Filed 2017·Granted Apr 9, 2019·3 cites·18 claims
- 0265US10537019B1Substrate dielectric crack prevention using interleaved metal planeNXP USA INC·Filed 2019·Granted Jan 14, 2020·1 cites·16 claims
- 0340US10147654B2Package materials monitor and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Dec 4, 2018·0 cites·20 claims
- 0432US9377504B2Integrated circuit interconnect crack monitor circuitCEJKA STANLEY A·Filed 2014·Granted Jun 28, 2016·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →