Inventor · disambiguated record
Stephan Dobritz
Also filed as: DOBRITZ STEPHAN
9 granted patents·7 pending applications·51 citations·filing 2002–2021
84Inventor score
Top patents by PatentIndex Score
16 records- 0183US7834462B2Electric device, stack of electric devices, and method of manufacturing a stack of electric devicesQIMONDA AG·Filed 2007·Granted Nov 16, 2010·17 cites·24 claims
- 0281US7221053B2Integrated device and electronic systemINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 22, 2007·9 cites·34 claims
- 0374US8093696B2Semiconductor deviceYOON KIMYUNG·Filed 2008·Granted Jan 10, 2012·9 cites·12 claims
- 0466US7068059B2Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connectionINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 27, 2006·12 cites·21 claims
- 0559US7867817B2Method for manufacturing a wafer level packageQIMONDA AG·Filed 2008·Granted Jan 11, 2011·1 cites·21 claims
- 0646US2007123066A1Interconnection element for BGA housings and method for producing the sameHANKE ANDRE·Filed 2007·Application pending·0 cites
- 0745US6946721B2Leadframe of a conductive material and component with a leadframe of a conductive materialINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 20, 2005·3 cites·14 claims
- 0845US2022181247A1Chip Module, Use of Chip Module, Test Arrangement and Test MethodFirst Sensor AG·Filed 2021·Application pending·0 cites
- 0944US2008079149A1Circuit board arrangement and method for producing a circuit board arrangementHEDLER HARRY·Filed 2006·Application pending·0 cites
- 1042US11728444B2Arrangement for an optoelectronic component, manufacturing process and optoelectronic componentFirst Sensor AG·Filed 2021·Granted Aug 15, 2023·0 cites·18 claims
- 1141US7220666B2Interconnection element for BGA housings and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 22, 2007·0 cites·20 claims
- 1241US2009001366A1Wafer Arrangement and Method for Manufacturing a Wafer ArrangementDOBRITZ STEPHAN·Filed 2007·Application pending·0 cites
- 1340US8072084B2Integrated circuit, circuit system, and method of manufacturingIRSIGLER ROLAND·Filed 2007·Granted Dec 6, 2011·0 cites·25 claims
- 1439US2007279877A1Circuit board arrangementDOBRITZ STEPHAN·Filed 2006·Application pending·0 cites
- 1536US2007230115A1Memory moduleDOBRITZ STEPHAN·Filed 2007·Application pending·0 cites
- 1634US2004189333A1Carrier for receiving and electrically contacting individually separated diesFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →