Interconnection element for BGA housings and method for producing the same

Abstract

An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.

1 . An electronic component comprising: 
 an interposer substrate;    at least one semiconductor chip mounted on the interposer substrate;    a plurality of electrical connections electrically coupling a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip; and    a plurality of connection elements positioned for electrical contact-connection with a printed circuit board, wherein the interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.    
   
   
       2 . The interconnection element as claimed in  claim 1 , wherein the electrical connections comprise wire bridges.  
   
   
       3 . The interconnection element as claimed in  claim 1 , wherein the connection elements at least partly project from the surface of the interposer substrate.  
   
   
       4 . The interconnection element as claimed in  claim 1 , wherein the connection elements have a diameter of approximately 25 μm.  
   
   
       5 . The interconnection element as claimed in  claim 1 , wherein the connection elements have a surface refinement.  
   
   
       6 . The interconnection element as claimed in  claim 5 , wherein the surface refinement comprises nickel and/or gold.  
   
   
       7 . An interconnection element for a BGA housing having an interposer substrate, on which at least one semiconductor chip is mounted by means of chip bonding, the chip being electrically connected to a rewiring of the interposer substrate by means of wire bridges, and the rewiring of the interposer substrate being electrically connected to a printed circuit board by means of an interconnection element for electrical contact-connection, wherein the interconnection element comprises the interposer substrate and a multiplicity of connection elements that are formed in hollow-cylindrical or rod-shaped fashion and are fixedly connected to the interposer substrate, in a manner penetrating through the interposer substrate and through the rewiring.