Inventor · disambiguated record
Steven Hurwitt
Also filed as: HURWITT STEVEN · HURWITT STEVEN D · UNTERKOFLER GEORGE J
46 granted patents·2,679 citations·filing 1974–2002
99Inventor score
Files withMATERIALS RESEARCH CORP26TOKYO ELECTRON LTD9SONY CORP7FRESH CREEK TECHNOLOGIES INC2BARADA ANDREW1
Top patents by PatentIndex Score
46 records- 0199US5415753AStationary aperture plate for reactive sputter depositionMATERIALS RESEARCH CORP·Filed 1993·Granted May 16, 1995·594 cites·11 claims
- 0297US4422896AMagnetically enhanced plasma process and apparatusMATERIALS RESEARCH CORP·Filed 1982·Granted Dec 27, 1983·102 cites·16 claims
- 0397US4198283AMagnetron sputtering target and cathode assemblyMATERIALS RESEARCH CORP·Filed 1978·Granted Apr 15, 1980·100 cites·26 claims
- 0496US4871433AMethod and apparatus for improving the uniformity ion bombardment in a magnetron sputtering systemMATERIALS RESEARCH CORP·Filed 1987·Granted Oct 3, 1989·89 cites·30 claims
- 0595US5126028ASputter coating process control method and apparatusMATERIALS RESEARCH CORP·Filed 1990·Granted Jun 30, 1992·177 cites·72 claims
- 0693US5223108AExtended lifetime collimatorMATERIALS RESEARCH CORP·Filed 1991·Granted Jun 29, 1993·78 cites·13 claims
- 0792US4957605AMethod and apparatus for sputter coating stepped wafersMATERIALS RESEARCH CORP·Filed 1989·Granted Sep 18, 1990·118 cites·120 claims
- 0892US4472259AFocusing magnetron sputtering apparatusMATERIALS RESEARCH CORP·Filed 1981·Granted Sep 18, 1984·49 cites·8 claims
- 0992US3953703AMethod for drying ceramic tapeMATERIALS RESEARCH CORP·Filed 1974·Granted Apr 27, 1976·51 cites·3 claims
- 1091US3991149AMethod for controlling the thickness of ceramic tapeHURWITT STEVEN·Filed 1974·Granted Nov 9, 1976·61 cites·2 claims
- 1190US4581118AShaped field magnetron electrodeMATERIALS RESEARCH CORP·Filed 1983·Granted Apr 8, 1986·75 cites·16 claims
- 1289US5632869AMethod of pretexturing a cathode sputtering target and sputter coating an article therewithSONY CORP·Filed 1992·Granted May 27, 1997·62 cites·12 claims
- 1389US4525262AMagnetron reactive bias sputtering method and apparatusMATERIALS RESEARCH CORP·Filed 1983·Granted Jun 25, 1985·35 cites·18 claims
- 1486US5795448AMagnetic device for rotating a substrateSONY CORP·Filed 1995·Granted Aug 18, 1998·95 cites·30 claims
- 1586US5562819AApparatus for trapping, signalling presence of and collecting debris in waterwaysFRESH CREEK TECHNOLOGIES INC·Filed 1995·Granted Oct 8, 1996·77 cites·13 claims
- 1686US5130005AMagnetron sputter coating method and apparatus with rotating magnet cathodeMATERIALS RESEARCH CORP·Filed 1990·Granted Jul 14, 1992·53 cites·22 claims
- 1786US4855033ACathode and target design for a sputter coating apparatusMATERIALS RESEARCH CORP·Filed 1987·Granted Aug 8, 1989·35 cites·20 claims
- 1885US5879524AComposite backing plate for a sputtering targetSONY CORP·Filed 1996·Granted Mar 9, 1999·48 cites·24 claims
- 1985US4428816AFocusing magnetron sputtering apparatusMATERIALS RESEARCH CORP·Filed 1983·Granted Jan 31, 1984·27 cites·19 claims
- 2083US4909695AMethod and apparatus for handling and processing wafer-like materialsMATERIALS RESEARCH CORP·Filed 1988·Granted Mar 20, 1990·79 cites·123 claims
- 2182US6689254B1Sputtering apparatus with isolated coolant and sputtering target thereforTOKYO ELECTRON LTD·Filed 1995·Granted Feb 10, 2004·38 cites·41 claims
- 2282US5174875AMethod of enhancing the performance of a magnetron sputtering targetMATERIALS RESEARCH CORP·Filed 1991·Granted Dec 29, 1992·53 cites·12 claims
- 2381US5925226AApparatus and method for clamping a substrateTOKYO ELECTRON LTD·Filed 1997·Granted Jul 20, 1999·66 cites·9 claims
- 2479US5409590ATarget cooling and support for magnetron sputter coating apparatusMATERIALS RESEARCH CORP·Filed 1991·Granted Apr 25, 1995·36 cites·5 claims
- 2577US5336386ATarget for cathode sputteringMATERIALS RESEARCH CORP·Filed 1992·Granted Aug 9, 1994·31 cites·4 claims
- 2676US5154730ASemiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the moduleMATERIALS RESEARCH CORP·Filed 1991·Granted Oct 13, 1992·65 cites·28 claims
- 2775US5346601ASputter coating collimator with integral reactive gas distributionBARADA ANDREW·Filed 1993·Granted Sep 13, 1994·45 cites·14 claims
- 2873US6623606B2Method and apparatus for sputter coating with variable target to substrate spacingTOKYO ELECTRON LTD·Filed 2002·Granted Sep 23, 2003·13 cites·14 claims
- 2971US6224724B1Physical vapor processing of a surface with non-uniformity compensationTOKYO ELECTRON LTD·Filed 1998·Granted May 1, 2001·39 cites·35 claims
- 3070US5391281APlasma shaping plug for control of sputter etchingMATERIALS RESEARCH CORP·Filed 1993·Granted Feb 21, 1995·22 cites·22 claims
- 3168US5284561AMethod and apparatus for sputter coating employing machine readable indicia carried by target assemblyMATERIALS RESEARCH CORP·Filed 1991·Granted Feb 8, 1994·19 cites·23 claims
- 3267US6416635B1Method and apparatus for sputter coating with variable target to substrate spacingTOKYO ELECTRON LTD·Filed 1995·Granted Jul 9, 2002·29 cites·6 claims
- 3367US5620578ASputtering apparatus having an on board service moduleSONY CORP·Filed 1996·Granted Apr 15, 1997·29 cites·7 claims
- 3463US5449445ASputtering target with machine readable indiciaMATERIALS RESEARCH CORP·Filed 1993·Granted Sep 12, 1995·15 cites·12 claims
- 3559US5783048ASputtering cathode with uniformity compensationTOKYO ELECTRON LTD·Filed 1996·Granted Jul 21, 1998·13 cites·12 claims
- 3658US6032419AVacuum processing apparatus with low particle generating vacuum sealTOKYO ELECTRON LTD·Filed 1997·Granted Mar 7, 2000·23 cites·6 claims
- 3756US5080772AMethod of improving ion flux distribution uniformity on a substrateMATERIALS RESEARCH CORP·Filed 1990·Granted Jan 14, 1992·17 cites·22 claims
- 3855US5205051AMethod of preventing condensation of air borne moisture onto objects in a vessel during pumping thereofMATERIALS RESEARCH CORP·Filed 1991·Granted Apr 27, 1993·25 cites·8 claims
- 3954US5474667AReduced stress sputtering target and method of manufacturing thereforMATERIALS RESEARCH CORP·Filed 1994·Granted Dec 12, 1995·16 cites·25 claims
- 4053US6464841B1Cathode having variable magnet configurationTOKYO ELECTRON LTD·Filed 1997·Granted Oct 15, 2002·16 cites·19 claims
- 4152US5490914AHigh utilization sputtering target for cathode assemblySONY CORP·Filed 1995·Granted Feb 13, 1996·14 cites·28 claims
- 4251US5569361AMethod and apparatus for cooling a sputtering targetSONY CORP·Filed 1995·Granted Oct 29, 1996·15 cites·41 claims
- 4343US5804041AMethod and apparatus for forming a magnetically oriented thin filmSONY CORP·Filed 1996·Granted Sep 8, 1998·9 cites·26 claims
- 4440US5237756AMethod and apparatus for reducing particulate contaminationMATERIALS RESEARCH CORP·Filed 1990·Granted Aug 24, 1993·11 cites·27 claims
- 4539US5366322AApparatus for containment of overflow and runoff waterFRESH CREEK TECHNOLOGIES INC·Filed 1993·Granted Nov 22, 1994·10 cites·23 claims
- 4635US6183523B1Apparatus for thermal control of variously sized articles in vacuumTOKYO ELECTRON LTD·Filed 1997·Granted Feb 6, 2001·5 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →