Inventor · disambiguated record
Stephen James
Also filed as: JAMES STEPHEN · JAMES STEPHEN L · JAMES STEPHEN LLOYD
32 granted patents·4 pending applications·346 citations·filing 1991–2022
97Inventor score
Files withMICRON TECHNOLOGY INC23IMPERIAL COLLEGE INNOVATIONS LTD3JAMES STEPHEN L3BIOVITRUM AB1COOPERS ANIMAL HEALTH1
Top patents by PatentIndex Score
36 records- 0197US7323767B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 29, 2008·121 cites·86 claims
- 0281US6518678B2Apparatus and method for reducing interposer compression during molding processMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 11, 2003·26 cites·53 claims
- 0381US6278175B1Leadframe alteration to direct compound flow into packageMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 21, 2001·21 cites·18 claims
- 0480US6451629B2Leadframe alteration to direct compound flow into packageMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 17, 2002·19 cites·4 claims
- 0578US6815835B2Single sided adhesive tape for compound diversion on BOC substratesMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 9, 2004·22 cites·33 claims
- 0677US7927923B2Method and apparatus for directing molding compound flow and resulting semiconductor device packagesMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 19, 2011·5 cites·9 claims
- 0776US8207599B2Method and apparatus for directing molding compound flow and resulting semiconductor device packagesJAMES STEPHEN L·Filed 2011·Granted Jun 26, 2012·3 cites·20 claims
- 0876US7054161B1Slotted adhesive for die-attach in BOC and LOC packagesJAMES STEPHEN L·Filed 2000·Granted May 30, 2006·25 cites·66 claims
- 0976US6979595B1Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 27, 2005·18 cites·2 claims
- 1072US7049685B2Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted May 23, 2006·14 cites·19 claims
- 1170US10443733B2Seal assembly with energizer and seal elementTRELLEBORG SEALING SOLUTIONS US INC·Filed 2017·Granted Oct 15, 2019·2 cites·16 claims
- 1268US7271037B2Leadframe alteration to direct compound flow into packageMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 18, 2007·2 cites·7 claims
- 1368US6473311B1Gate area relief strip for a molded I/C packageMICRO TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·13 cites·39 claims
- 1467US7459797B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 2, 2008·9 cites·30 claims
- 1565US8399966B2Inserts for directing molding compound flow and semiconductor die assembliesJAMES STEPHEN L·Filed 2012·Granted Mar 19, 2013·1 cites·20 claims
- 1662US7501309B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 10, 2009·1 cites·32 claims
- 1759US7053467B2Leadframe alteration to direct compound flow into packageMICRON TECHNOLOGY INC·Filed 2002·Granted May 30, 2006·5 cites·10 claims
- 1858US12053886B2Device control using policy training based on task embeddingsIMPERIAL COLLEGE INNOVATIONS LTD·Filed 2021·Granted Aug 6, 2024·0 cites·6 claims
- 1957US12260582B2Image processing system and methodIMPERIAL COLLEGE INNOVATIONS LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 2057US6690086B2Apparatus and method for reducing interposer compression during molding processMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 10, 2004·6 cites·24 claims
- 2155US8716847B2Inserts for directing molding compound flow and semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2013·Granted May 6, 2014·0 cites·23 claims
- 2254US7462510B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 9, 2008·3 cites·70 claims
- 2351US2006237832A1Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2450US7271036B2Leadframe alteration to direct compound flow into packageMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 18, 2007·0 cites·9 claims
- 2550US7247927B2Leadframe alteration to direct compound flow into packageMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 24, 2007·0 cites·12 claims
- 2649US2006180907A1Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devicesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2747US12380592B2Image processing system and methodIMPERIAL COLLEGE INNOVATIONS LTD·Filed 2022·Granted Aug 5, 2025·0 cites·18 claims
- 2847US6734372B2Gate area relief strip for a molded I/C packageMICRON TECHNOLOGY INC·Filed 2002·Granted May 11, 2004·2 cites·33 claims
- 2947US6657132B2Single sided adhesive tape for compound diversion on BOC substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 2, 2003·2 cites·30 claims
- 3047US6396133B1Semiconductor device with heat-dissipating lead-frame and process of manufacturing sameMICRON TECHNOLOGY INC·Filed 1998·Granted May 28, 2002·13 cites·22 claims
- 3144US9359843B2Anchoring system and method of anchoring and unanchoring the sameTONTI NICHOLAS K·Filed 2012·Granted Jun 7, 2016·1 cites·12 claims
- 3241US2006261498A1Methods and apparatuses for encapsulating microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 3337US6498182B2CompoundsBIOVITRUM AB·Filed 2001·Granted Dec 24, 2002·0 cites·24 claims
- 3436US5864008APeptides derived from foot-and-mouth disease virus, pharmaceutical compositions, and methods for using the peptidesFiled 1992·Granted Jan 26, 1999·8 cites·7 claims
- 3532US5401829ABiologically active moleculesCOOPERS ANIMAL HEALTH·Filed 1991·Granted Mar 28, 1995·4 cites·6 claims
- 3631US2004058868A1Methods for identification of compounds modulating insulin resistanceFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Stephen James files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →