Inventor · disambiguated record
Steffen Jordan
Also filed as: JORDAN STEFFEN
10 granted patents·2 pending applications·17 citations·filing 2007–2023
81Inventor score
Top patents by PatentIndex Score
12 records- 0192US11862600B2Method of forming a chip package and chip packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·2 cites·22 claims
- 0277US8246330B2Integrated catalystAY DOGAN·Filed 2009·Granted Aug 21, 2012·10 cites·15 claims
- 0374US12288727B2Method of manufacturing a package having an adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2023·Granted Apr 29, 2025·0 cites·15 claims
- 0464US11652012B2Inorganic encapsulant for electronic component with adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·17 claims
- 0563US8410586B2Semiconductor package and method of assembling a semiconductor packageRIEDL EDMUND·Filed 2008·Granted Apr 2, 2013·5 cites·24 claims
- 0646US7989930B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 2, 2011·0 cites·22 claims
- 0744US2011123367A1Device for Operating an Auxiliary Assembly of a Vehicle, in Particular of a Utility VehicleJORDAN STEFFEN·Filed 2009·Application pending·0 cites
- 0843US10229885B2Method of galvanic plating assisted by a current distribution layerINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 12, 2019·0 cites·14 claims
- 0943US2013133768A1Compressor System for a Compressed Air Supply ArrangementFEYERABEND KONRAD·Filed 2012·Application pending·0 cites
- 1041US10229891B2Chip embedding package with solderable electric contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 12, 2019·0 cites·22 claims
- 1140US10366924B2Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performanceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 30, 2019·0 cites·21 claims
- 1234US9074594B2Compressed-air compressor and method of operationJORDAN STEFFEN·Filed 2011·Granted Jul 7, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →