Inventor · disambiguated record
Stefan Landau
Also filed as: LANDAU STEFAN
22 granted patents·6 pending applications·101 citations·filing 2006–2014
94Inventor score
Top patents by PatentIndex Score
28 records- 0193US7479691B2Power semiconductor module having surface-mountable flat external contacts and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 20, 2009·31 cites·23 claims
- 0283US7872350B2Multi-chip moduleQIMONDA AG·Filed 2007·Granted Jan 18, 2011·12 cites·17 claims
- 0378US8664043B2Method of manufacturing a laminate electronic device including separating a carrier into a plurality of partsEWE HENRIK·Filed 2009·Granted Mar 4, 2014·6 cites·25 claims
- 0477US9147649B2Multi-chip moduleLANDAU STEFAN·Filed 2008·Granted Sep 29, 2015·9 cites·15 claims
- 0575US8129225B2Method of manufacturing an integrated circuit moduleLANDAU STEFAN·Filed 2007·Granted Mar 6, 2012·7 cites·25 claims
- 0673US7955954B2Method of making semiconductor devices employing first and second carriersINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 7, 2011·5 cites·24 claims
- 0771US7955901B2Method for producing a power semiconductor module comprising surface-mountable flat external contactsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 7, 2011·6 cites·25 claims
- 0870US9142739B2Method and system for providing a reliable light emitting diode semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 22, 2015·2 cites·21 claims
- 0970US8866302B2Device including two semiconductor chips and manufacturing thereofEWE HENRIK·Filed 2011·Granted Oct 21, 2014·3 cites·22 claims
- 1069US8686569B2Die arrangement and method of forming a die arrangementDAECHE FRANK·Filed 2010·Granted Apr 1, 2014·4 cites·15 claims
- 1168US10020245B2Laminate electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 10, 2018·1 cites·20 claims
- 1267US8980687B2Semiconductor device and method of manufacturing thereofNIKITIN IVAN·Filed 2012·Granted Mar 17, 2015·2 cites·25 claims
- 1363US8828804B2Semiconductor device and methodNIKITIN IVAN·Filed 2008·Granted Sep 9, 2014·2 cites·7 claims
- 1463US8101463B2Method of manufacturing a semiconductor deviceMENGEL MANFRED·Filed 2009·Granted Jan 24, 2012·2 cites·16 claims
- 1562US8097944B2Semiconductor deviceLANDAU STEFAN·Filed 2009·Granted Jan 17, 2012·2 cites·15 claims
- 1662US7667337B2Semiconductor device with conductive die attach materialINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 23, 2010·2 cites·8 claims
- 1761US8253241B2Electronic moduleLANDAU STEFAN·Filed 2008·Granted Aug 28, 2012·2 cites·20 claims
- 1861US8097959B2Semiconductor device including first and second carriersLANDAU STEFAN·Filed 2010·Granted Jan 17, 2012·1 cites·22 claims
- 1960US8687370B2Housing for a chip arrangement and a method for forming a housingLANDAU STEFAN·Filed 2011·Granted Apr 1, 2014·1 cites·21 claims
- 2056US8969985B2Semiconductor chip package and methodSTRUTZ VOLKER·Filed 2011·Granted Mar 3, 2015·1 cites·20 claims
- 2148US8836113B2Electronic moduleLANDAU STEFAN·Filed 2012·Granted Sep 16, 2014·0 cites·16 claims
- 2247US9953952B2Semiconductor device having a sealant layer including carbon directly contact the chip and the carrierMAHLER JOACHIM·Filed 2008·Granted Apr 24, 2018·0 cites·6 claims
- 2344US2007241328A1Process for producing power semiconductor components using a markerINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2443US2008067667A1Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2542US2008061449A1Semiconductor Component ArrangementINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2641US2012061700A1Method and system for providing a reliable light emitting diode semiconductor deviceEDER ANDREAS·Filed 2010·Application pending·0 cites
- 2737US2013264721A1Electronic ModuleLANDAU STEFAN·Filed 2012·Application pending·0 cites
- 2835US2013341780A1Chip arrangements and a method for forming a chip arrangementSCHARF THORSTEN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →