Inventor · disambiguated record
Stephen Prouty
Also filed as: PROUTY STEPHEN · PROUTY STEPHEN D · PROUTY STEPHEN DONALD
23 granted patents·8 pending applications·127 citations·filing 2013–2024
94Inventor score
Top patents by PatentIndex Score
31 records- 0197US10168260B2Self-filling soil processing chamber with dynamic extractant volumeWINFIELD SOLUTIONS LLC·Filed 2017·Granted Jan 1, 2019·16 cites·19 claims
- 0297US9291545B1Self-filling soil processing chamber with dynamic extractant volumeMONSANTO TECHNOLOGY LLC·Filed 2013·Granted Mar 22, 2016·34 cites·16 claims
- 0396US11380572B2Substrate support carrier with improved bond layer protectionAPPLIED MATERIALS INC·Filed 2020·Granted Jul 5, 2022·4 cites·20 claims
- 0496US9739693B2Self-filling soil processing chamber with dynamic extractant volumeMONSANTO TECHNOLOGY LLC·Filed 2016·Granted Aug 22, 2017·14 cites·17 claims
- 0595US11764041B2Adjustable thermal break in a substrate supportAPPLIED MATERIALS INC·Filed 2020·Granted Sep 19, 2023·4 cites·18 claims
- 0695US11646183B2Substrate support assembly with arc resistant coolant conduitAPPLIED MATERIALS INC·Filed 2020·Granted May 9, 2023·4 cites·19 claims
- 0795US9146223B1Automated soil measurement deviceMONSANTO TECHNOLOGY LLC·Filed 2013·Granted Sep 29, 2015·24 cites·30 claims
- 0894US9863925B2Automated soil measurement deviceMONSANTO TECHNOLOGY LLC·Filed 2015·Granted Jan 9, 2018·13 cites·13 claims
- 0992US11373893B2Cryogenic electrostatic chuckAPPLIED MATERIALS INC·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 1091US11569114B2Semiconductor processing with cooled electrostatic chuckAPPLIED MATERIALS INC·Filed 2021·Granted Jan 31, 2023·2 cites·20 claims
- 1180US12444585B2Electrical connector for cooled substrate support assemblyAPPLIED MATERIALS INC·Filed 2020·Granted Oct 14, 2025·1 cites·20 claims
- 1280US11666952B2Condition selectable backside gasAPPLIED MATERIALS INC·Filed 2020·Granted Jun 6, 2023·1 cites·6 claims
- 1379US11075105B2In-situ apparatus for semiconductor process moduleAPPLIED MATERIALS INC·Filed 2018·Granted Jul 27, 2021·2 cites·16 claims
- 1477US11456161B2Substrate support pedestalAPPLIED MATERIALS INC·Filed 2019·Granted Sep 27, 2022·3 cites·19 claims
- 1571US11651987B2Substrate support carrier with improved bond layer protectionAPPLIED MATERIALS INC·Filed 2022·Granted May 16, 2023·0 cites·20 claims
- 1670US12397330B2Condition selectable backside gasAPPLIED MATERIALS INC·Filed 2023·Granted Aug 26, 2025·0 cites·19 claims
- 1769US10410900B2Precision screen printing with sub-micron uniformity of metallization materials on green sheet ceramicAPPLIED MATERIALS INC·Filed 2017·Granted Sep 10, 2019·1 cites·7 claims
- 1869US2019120737A1Self-filling soil processing chamber with dynamic extractant volumeWINFIELD SOLUTIONS LLC·Filed 2018·Application pending·0 cites
- 1967US10586718B2Cooling base with spiral channels for ESCAPPLIED MATERIALS INC·Filed 2016·Granted Mar 10, 2020·1 cites·18 claims
- 2065US10641756B2Automated soil measurementWINFIELD SOLUTIONS LLC·Filed 2017·Granted May 5, 2020·0 cites·20 claims
- 2164US11887879B2In-situ apparatus for semiconductor process moduleAPPLIED MATERIALS INC·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 2257US12033881B2Reduced localized force in electrostatic chuckingAPPLIED MATERIALS INC·Filed 2021·Granted Jul 9, 2024·0 cites·18 claims
- 2357US2025323463A1Electrical feedthrough connector for a substrate support assemblyAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2457US2025014878A1Wafer edge profile control using connected edge ring hardwareAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2556US2024408712A1Ceramic cooling baseAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2654US2024110836A1Vacuum sealing integrity of cryogenic electrostatic chucks using non-contact surface temperature measuring probesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2753US2024112894A1Fluid conduit and flange for high bias applicationsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2852US2019273008A1Precision screen printing with sub-micron uniformity of metallization materials on green sheet ceramicAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2951US2024249965A1Substrate support carrier having multiple ceramic discsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3047US11437261B2Cryogenic electrostatic chuckAPPLIED MATERIALS INC·Filed 2018·Granted Sep 6, 2022·0 cites·20 claims
- 3146US12334315B2Cooled substrate support assembly for radio frequency environmentsAPPLIED MATERIALS INC·Filed 2020·Granted Jun 17, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →