Inventor · disambiguated record
Stefan Schwab
Also filed as: SCHWAB STEFAN
12 granted patents·15 pending applications·15 citations·filing 2015–2025
84Inventor score
Files withINFINEON TECHNOLOGIES AG20INFINEON TECHNOLOGIES AUSTRIA AG6EBM PAPST MULFINGEN GMBH & CO KG1
Top patents by PatentIndex Score
27 records- 0193US12347805B2Inkjet printing of diffusion solderINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jul 1, 2025·2 cites·5 claims
- 0291US9844134B2Device including a metallization layer and method of manufacturing a deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 12, 2017·10 cites·21 claims
- 0381US12027490B2Semiconductor device and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 2, 2024·1 cites·15 claims
- 0480US11404359B2Leadframe package with isolation layerINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 2, 2022·1 cites·28 claims
- 0574US12288727B2Method of manufacturing a package having an adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2023·Granted Apr 29, 2025·0 cites·15 claims
- 0674US2024413033A1Interlayer of Sub-structure Having Elevations and Further Sub-structure with Filler Particles in Recesses Between the ElevationsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0772US2025300127A1Inkjet printing of diffusion solderINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 0869US11486407B2Method for controlling at least two fansEBM PAPST MULFINGEN GMBH & CO KG·Filed 2018·Granted Nov 1, 2022·1 cites·17 claims
- 0965US12136578B2Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevationsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 5, 2024·0 cites·15 claims
- 1064US11652012B2Inorganic encapsulant for electronic component with adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·17 claims
- 1161US2025096056A1Encapsulant with porous colorant for electronic packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1258US2024332102A1Package with encapsulant and further encapsulant thereonINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1355US2023420319A1Semiconductor package encapsulant with metal activated inorganic filler particlesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1454US2023274996A1Chip arrangement, chip package, method of forming a chip arrangement, and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1553US2024178109A1Semiconductor Package with InsertINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 1651US11424217B2Soldering a conductor to an aluminum layerINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 1750US2022275217A1Filler particle having morphological adhesion promoter shell on coreINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1848US2024112993A1Semiconductor Device Comprising a Leadframe Adapted for Higher Current Output or Improved Placement of Additional DevicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1947US2021166986A1Package with encapsulant under compressive stressINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2046US2022415732A1Semiconductor module with shaped external contact for reduced crack formation in the encapsulation bodyINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2145US2020227339A1Interface Material Having a Polymer CeramicINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2245US2025336775A1Semiconductor packages and associated manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 2345US2020231800A1Corrosion Protected Mold CompoundINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2443US12152133B2Mold compounds and packages for encapsulating electronic componentsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 2542US2020381314A1Method for Providing Coated Leadframes or for Measuring an Adhesion Force of an Encapsulant on a LeadframeINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2637US9818602B2Method of depositing a resin material on a semiconductor body with an inkjet processINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Nov 14, 2017·0 cites·15 claims
- 2736US10910284B2Semiconductor device and method of manufacturing thereofINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Feb 2, 2021·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Stefan Schwab files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →