Inventor · disambiguated record
Steven Trey Tindel
Also filed as: TINDEL STEVEN TREY
11 granted patents·5 pending applications·13 citations·filing 2019–2025
81Inventor score
Files withAPPLIED MATERIALS INC16
Top patents by PatentIndex Score
16 records- 0195US12283503B2Substrate measurement subsystemAPPLIED MATERIALS INC·Filed 2021·Granted Apr 22, 2025·3 cites·20 claims
- 0283USD977504SPortion of a display panel with a graphical user interfaceAPPLIED MATERIALS INC·Filed 2020·Granted Feb 7, 2023·10 cites·1 claims
- 0372US12191176B2Integrated substrate measurement system to improve manufacturing process performanceAPPLIED MATERIALS INC·Filed 2023·Granted Jan 7, 2025·0 cites·16 claims
- 0470US2025218829A1Substrate measurement subsystemAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0568US11183411B2Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiencyAPPLIED MATERIALS INC·Filed 2021·Granted Nov 23, 2021·0 cites·18 claims
- 0663US11688616B2Integrated substrate measurement system to improve manufacturing process performanceAPPLIED MATERIALS INC·Filed 2021·Granted Jun 27, 2023·0 cites·10 claims
- 0759US12370573B2Equipment front end modules with induced gas mixing, and methods of use thereofAPPLIED MATERIALS INC·Filed 2022·Granted Jul 29, 2025·0 cites·17 claims
- 0859US12140339B2Filter isolation for equipment front end moduleAPPLIED MATERIALS INC·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 0959US2023062206A1Determining substrate profile properties using machine learningAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1057US10916464B1Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiencyAPPLIED MATERIALS INC·Filed 2019·Granted Feb 9, 2021·0 cites·13 claims
- 1154US2025069926A1Integrated substrate processing system with advanced substrate handling robotAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1253US2022026817A1Determining substrate profile properties using machine learningAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1350US11196360B2System and method for electrostatically chucking a substrate to a carrierAPPLIED MATERIALS INC·Filed 2019·Granted Dec 7, 2021·0 cites·19 claims
- 1449US11756816B2Carrier FOUP and a method of placing a carrierAPPLIED MATERIALS INC·Filed 2019·Granted Sep 12, 2023·0 cites·20 claims
- 1549US2022066411A1Detecting and correcting substrate process drift using machine learningAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1644US11511950B2Substrate flipping deviceAPPLIED MATERIALS INC·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Steven Trey Tindel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →