Inventor · disambiguated record
Stephen Turner
Also filed as: TURNER STEPHEN · TURNER STEPHEN P
9 granted patents·11 pending applications·215 citations·filing 1998–2016
89Inventor score
Top patents by PatentIndex Score
20 records- 0197US6331233B1Tantalum sputtering target with fine grains and uniform texture and method of manufactureHONEYWELL INT INC·Filed 2000·Granted Dec 18, 2001·132 cites·6 claims
- 0294US7101447B2Tantalum sputtering target with fine grains and uniform texture and method of manufactureHONEYWELL INT INC·Filed 2001·Granted Sep 5, 2006·38 cites·21 claims
- 0375US6833058B1Titanium-based and zirconium-based mixed materials and sputtering targetsHONEYWELL INT INC·Filed 2000·Granted Dec 21, 2004·10 cites·11 claims
- 0474US7517417B2Tantalum PVD component producing methodsHONEYWELL INT INC·Filed 2006·Granted Apr 14, 2009·2 cites·28 claims
- 0572US6454911B1Method and apparatus for determining the pass through flux of magnetic materialsHONEYWELL INT INC·Filed 2000·Granted Sep 24, 2002·14 cites·44 claims
- 0658US6391172B2High purity cobalt sputter target and process of manufacturing the sameALTA GROUP INC·Filed 1998·Granted May 21, 2002·13 cites·17 claims
- 0757US6585866B2High purity cobalt sputter target and process of manufacturing the sameHONEYWELL INT INC·Filed 2002·Granted Jul 1, 2003·2 cites·10 claims
- 0851US6821552B2Method and apparatus for determining the pass through flux of magnetic materialsHONEYWELL INT INC·Filed 2002·Granted Nov 23, 2004·4 cites·17 claims
- 0951US2009053540A1Physical Vapor Deposition Targets Comprising Ti and Zr and Methods of UseTURNER STEPHEN P·Filed 2008·Application pending·0 cites
- 1048US2005230013A1Methods of making nickel/vanadium structuresGUO WEI·Filed 2005·Application pending·0 cites
- 1141US2004166693A1Sputtering target compositions, and methods of inhibiting copper diffusion into a substrateFiled 2004·Application pending·0 cites
- 1241US2004164420A1Sputtering target compositions, and methods of inhibiting copper diffusion into a substrateFiled 2004·Application pending·0 cites
- 1340US2003052000A1Fine grain size material, sputtering target, methods of forming, and micro-arc reduction methodFiled 2002·Application pending·0 cites
- 1440US2003132123A1Methods of forming titanium-based and zirconium-based mixed-metal materialsFiled 2003·Application pending·0 cites
- 1538US2003227068A1Sputtering targetFiled 2001·Application pending·0 cites
- 1638US2018113099A1A void free inclusion-based reference standard for nondestructive tests and method of makingHONEYWELL INT INC·Filed 2016·Application pending·0 cites
- 1737US2004119131A1Physical vapor deposition on targets comprising Ti and Zr; and methods of useFiled 2001·Application pending·0 cites
- 1837US2006037672A1High-purity titanium-nickel alloys with shape memoryLOVE DAVID B·Filed 2004·Application pending·0 cites
- 1934US2004108028A1High purity nickel/vanadium sputtering components; and methods of making sputtering componentsFiled 2003·Application pending·0 cites
- 2033US7219412B2Methods of forming titanium-containing superconducting compositionsHONEYWELL INT INC·Filed 2004·Granted May 22, 2007·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →