Inventor · disambiguated record
Steven Verhaverbeke
Also filed as: VERHAVERBEKE STEVEN · VERHAVERBEKE STEVEN VERHAVERBE
136 granted patents·78 pending applications·1,554 citations·filing 1996–2025
99Inventor score
Top patents by PatentIndex Score
214 records- 0198US11676832B2Laser ablation system for package fabricationAPPLIED MATERIALS INC·Filed 2020·Granted Jun 13, 2023·7 cites·18 claims
- 0298US11462417B2High pressure and high temperature anneal chamberAPPLIED MATERIALS INC·Filed 2020·Granted Oct 4, 2022·6 cites·20 claims
- 0398US10886232B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 5, 2021·16 cites·19 claims
- 0498US10229827B2Method of redistribution layer formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 12, 2019·33 cites·13 claims
- 0598US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
- 0697US10276411B2High pressure and high temperature anneal chamberAPPLIED MATERIALS INC·Filed 2017·Granted Apr 30, 2019·25 cites·8 claims
- 0797US10096516B1Method of forming a barrier layer for through via applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Oct 9, 2018·25 cites·18 claims
- 0897US6165912AElectroless metal deposition of electronic components in an enclosable vesselCFMT INC·Filed 1999·Granted Dec 26, 2000·309 cites·20 claims
- 0996US11264331B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 1, 2022·10 cites·19 claims
- 1096US11018032B2High pressure and high temperature anneal chamberAPPLIED MATERIALS INC·Filed 2019·Granted May 25, 2021·15 cites·22 claims
- 1196US10636677B2High pressure and high temperature anneal chamberAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·17 cites·5 claims
- 1295US11715700B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 1395US10234630B2Method for creating a high refractive index wave guideAPPLIED MATERIALS INC·Filed 2017·Granted Mar 19, 2019·15 cites·20 claims
- 1495US7585686B2Method and apparatus for processing a waferAPPLIED MATERIALS INC·Filed 2007·Granted Sep 8, 2009·33 cites·18 claims
- 1595US7334588B2Method and apparatus for wafer cleaningAPPLIED MATERIALS INC·Filed 2006·Granted Feb 26, 2008·26 cites·31 claims
- 1695US7159599B2Method and apparatus for processing a waferAPPLIED MATERIALS INC·Filed 2002·Granted Jan 9, 2007·96 cites·41 claims
- 1794US11257790B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·3 cites·10 claims
- 1893US10937726B1Package structure with embedded coreAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 1993US7000621B1Methods and apparatuses for drying waferAPPLIED MATERIALS INC·Filed 2004·Granted Feb 21, 2006·57 cites·30 claims
- 2093US6927176B2Cleaning method and solution for cleaning a wafer in a single wafer processAPPLIED MATERIALS INC·Filed 2001·Granted Aug 9, 2005·67 cites·76 claims
- 2192US7456113B2Cleaning method and solution for cleaning a wafer in a single wafer processAPPLIED MATERIALS INC·Filed 2005·Granted Nov 25, 2008·23 cites·20 claims
- 2291US11232951B1Method and apparatus for laser drilling blind viasAPPLIED MATERIALS INC·Filed 2020·Granted Jan 25, 2022·2 cites·22 claims
- 2391US10347511B2Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STRAPPLIED MATERIALS INC·Filed 2017·Granted Jul 9, 2019·5 cites·15 claims
- 2490US11566322B2Shadow mask with plasma resistant coatingAPPLIED MATERIALS INC·Filed 2016·Granted Jan 31, 2023·4 cites·13 claims
- 2590US6843855B2Methods for drying waferAPPLIED MATERIALS INC·Filed 2002·Granted Jan 18, 2005·44 cites·20 claims
- 2689US11521937B2Package structures with built-in EMI shieldingAPPLIED MATERIALS INC·Filed 2020·Granted Dec 6, 2022·2 cites·20 claims
- 2789US7037842B2Method and apparatus for dissolving a gas into a liquid for single wet wafer processingAPPLIED MATERIALS INC·Filed 2003·Granted May 2, 2006·43 cites·22 claims
- 2888US7449127B2Cleaning method and solution for cleaning a wafer in a single wafer processAPPLIED MATERIALS INC·Filed 2005·Granted Nov 11, 2008·10 cites·22 claims
- 2987US8778816B2In situ vapor phase surface activation of SiO2SATO TATSUYA E·Filed 2011·Granted Jul 15, 2014·9 cites·19 claims
- 3087US5972123AMethods for treating semiconductor wafersCFMT INC·Filed 1998·Granted Oct 26, 1999·90 cites·10 claims
- 3185US12354968B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 3285US10727083B1Method for via formation in flowable epoxy materials by micro-imprintAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·4 cites·20 claims
- 3385US8535766B2Patterning of magnetic thin film using energized ionsVERHAVERBEKE STEVEN·Filed 2008·Granted Sep 17, 2013·8 cites·9 claims
- 3485US8354035B2Method for removing implanted photo resist from hard disk drive substratesAPPLIED MATERIALS INC·Filed 2010·Granted Jan 15, 2013·4 cites·19 claims
- 3585US7819985B2Method and apparatus for wafer cleaningAPPLIED MATERIALS INC·Filed 2006·Granted Oct 26, 2010·6 cites·16 claims
- 3684US11063169B2Substrate structuring methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 13, 2021·2 cites·20 claims
- 3784US9105921B2Porous amorphous silicon—carbon nanotube composite based electrodes for battery applicationsAPPLIED MATERIALS INC·Filed 2013·Granted Aug 11, 2015·5 cites·16 claims
- 3884US7435686B2Semiconductor processing using energized hydrogen gas and in combination with wet cleaningAPPLIED MATERIALS INC·Filed 2006·Granted Oct 14, 2008·8 cites·17 claims
- 3983US11887934B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 4083US8551578B2Patterning of magnetic thin film using energized ions and thermal excitationNALAMASU OMKARAM·Filed 2008·Granted Oct 8, 2013·9 cites·8 claims
- 4183US7469883B2Cleaning method and solution for cleaning a wafer in a single wafer processAPPLIED MATERIALS INC·Filed 2006·Granted Dec 30, 2008·9 cites·8 claims
- 4283US7432177B2Post-ion implant cleaning for silicon on insulator substrate preparationAPPLIED MATERIALS INC·Filed 2005·Granted Oct 7, 2008·7 cites·21 claims
- 4382US7021319B2Assisted rinsing in a single wafer cleaning processAPPLIED MATERIALS INC·Filed 2001·Granted Apr 4, 2006·23 cites·12 claims
- 4482US2025281998A1Method and apparatus for laser drilling blind viasAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 4580US11388822B2Methods for improved polymer-copper adhesionAPPLIED MATERIALS INC·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 4680US8586952B2Temperature control of a substrate during a plasma ion implantation process for patterned disc media applicationsHILKENE MARTIN A·Filed 2010·Granted Nov 19, 2013·5 cites·17 claims
- 4779US10304703B2Small thermal mass pressurized chamberAPPLIED MATERIALS INC·Filed 2016·Granted May 28, 2019·2 cites·11 claims
- 4879US10032624B2Substrate support and baffle apparatusAPPLIED MATERIALS INC·Filed 2016·Granted Jul 24, 2018·2 cites·18 claims
- 4979US9343664B2Pattern fortification for HDD bit patterned media pattern transferAPPLIED MATERIALS INC·Filed 2015·Granted May 17, 2016·2 cites·20 claims
- 5079US8986557B2HDD patterning using flowable CVD filmAPPLIED MATERIALS INC·Filed 2014·Granted Mar 24, 2015·4 cites·16 claims
Showing the top 50 of 214 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →