Inventor · disambiguated record
Stephan Wege
Also filed as: WEGE STEPHAN
26 granted patents·16 pending applications·429 citations·filing 1998–2023
96Inventor score
Top patents by PatentIndex Score
42 records- 0194US6479373B2Method of structuring layers with a polysilicon layer and an overlying metal or metal silicide layer using a three step etching process with fluorine, chlorine, bromine containing gasesINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 12, 2002·237 cites·21 claims
- 0280US6153492AMethod for improving the readability of alignment marksINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 28, 2000·33 cites·22 claims
- 0379US7141507B2Method for production of a semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 28, 2006·9 cites·14 claims
- 0477US7544270B2Apparatus for processing a substrateINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 9, 2009·8 cites·23 claims
- 0573US6177353B1Metallization etching techniques for reducing post-etch corrosion of metal linesINFINEON TECHNOLOGIES CORP·Filed 1998·Granted Jan 23, 2001·52 cites·15 claims
- 0669US7846846B2Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewallsAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·4 cites·19 claims
- 0767US6897155B2Method for etching high-aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2002·Granted May 24, 2005·11 cites·19 claims
- 0866US7879395B2Method of preparing a coating solution and a corresponding use of the coating solution for coating a substrateQIMONDA AG·Filed 2006·Granted Feb 1, 2011·4 cites·13 claims
- 0966US7737049B2Method for forming a structure on a substrate and deviceQIMONDA AG·Filed 2007·Granted Jun 15, 2010·2 cites·23 claims
- 1066US7265023B2Fabrication method for a semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 4, 2007·5 cites·8 claims
- 1166US6511918B2Method of structuring a metal-containing layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jan 28, 2003·15 cites·12 claims
- 1265US6541372B2Method for manufacturing a conductor structure for an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 1, 2003·10 cites·18 claims
- 1363US6919269B2Production method for a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 19, 2005·9 cites·12 claims
- 1463US6583020B2Method for fabricating a trench isolation for electrically active componentsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 24, 2003·13 cites·9 claims
- 1557US6693022B2CVD method of producing in situ-doped polysilicon layers and polysilicon layered structuresINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 17, 2004·6 cites·17 claims
- 1656US7368390B2Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition processINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 6, 2008·6 cites·10 claims
- 1756US2025196060A1Apparatus and process for splitting up substancesWEGE STEPHAN·Filed 2023·Application pending·0 cites
- 1855US9330922B2Self-aligned stack gate structure for use in a non-volatile memory array and a method of forming such structureTOREN WILLEM-JAN·Filed 2012·Granted May 3, 2016·1 cites·10 claims
- 1951US2025157792A1Symmetrical Process ReactorWEGE STEPHAN·Filed 2023·Application pending·0 cites
- 2049US10971340B2Gas injector for reaction regionsWEGE STEPHAN·Filed 2017·Granted Apr 6, 2021·0 cites·17 claims
- 2146US2009321940A1Method for Manufacturing Contact Openings, Method for Manufacturing an Integrated Circuit, an Integrated CircuitKUNKEL GERHARD·Filed 2008·Application pending·0 cites
- 2246US2009219496A1Methods of Double Patterning, Photo Sensitive Layer Stack for Double Patterning and System for Double PatterningKAMM FRANK-MICHAEL·Filed 2008·Application pending·0 cites
- 2345US2009166318A1Method of Fabricating an Integrated CircuitSEITZ MIHEL·Filed 2007·Application pending·0 cites
- 2444US6380076B2Dielectric filling of electrical wiring planesINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 30, 2002·1 cites·15 claims
- 2543US6596625B2Method and device for producing a metal/metal contact in a multilayer metallization of an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jul 22, 2003·3 cites·5 claims
- 2642US2010330805A1Methods for forming high aspect ratio features on a substrateDOAN KENNY LINH·Filed 2007·Application pending·0 cites
- 2741US2009239314A1Methods of Manufacturing a Semiconductor DeviceHABERJAHN MARTIN·Filed 2008·Application pending·0 cites
- 2840US9570581B2Method of forming a self-aligned stack gate structure for use in a non-volatile memory arraySILICON STORAGE TECH INC·Filed 2016·Granted Feb 14, 2017·0 cites·9 claims
- 2939US7105404B2Method for fabricating a semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 12, 2006·0 cites·8 claims
- 3039US2004192060A1Method for fabricating a semiconductor structureFiled 2004·Application pending·0 cites
- 3139US2009115027A1Method of Fabricating an Integrated CircuitWEGE STEPHAN·Filed 2007·Application pending·0 cites
- 3238US7037777B2Process for producing an etching mask on a microstructure, in particular a semiconductor structure with trench capacitors, and corresponding use of the etching maskINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 2, 2006·0 cites·12 claims
- 3338US2009127722A1Method for Processing a Spacer Structure, Method of Manufacturing an Integrated Circuit, Semiconductor Device and Intermediate Structure with at Least One Spacer StructureNOELSCHER CHRISTOPH·Filed 2007·Application pending·0 cites
- 3437US2005148193A1Photolithographic method for forming a structure in a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2002·Application pending·0 cites
- 3537US2005239223A1Method and device for monitoring the etching operation for a regular depth structure in a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 3637US2007123045A1Method for the treatment of material, in particular in the fabrication of semiconductor componentsWEGE STEPHAN·Filed 2006·Application pending·0 cites
- 3736US6821894B2CMP processINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 23, 2004·0 cites·7 claims
- 3836US2002011462A1Method of processing organic antireflection layersFiled 2001·Application pending·0 cites
- 3936US2009102023A1Method for Manufacturing a Structure, Semiconductor Device and Structure on a SubstrateWEGE STEPHAN·Filed 2007·Application pending·0 cites
- 4032US6380074B1Deposition of various base layers for selective layer growth in semiconductor productionINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 30, 2002·0 cites·11 claims
- 4131US2007232070A1Method and device for depositing a protective layer during an etching procedureWEGE STEPHAN·Filed 2006·Application pending·0 cites
- 4230US6436731B2Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing materialINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 20, 2002·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →