Inventor · disambiguated record
Susumu Baba
Also filed as: BABA SUSUMU
22 granted patents·4 pending applications·110 citations·filing 1984–2020
93Inventor score
Files withMITSUBISHI PAPER MILLS LTD10SEKISUI CHEMICAL CO LTD6BABA SUSUMU3DAINIPPON PRINTING CO LTD2SAKAMOTO RYUICHI2
Top patents by PatentIndex Score
26 records- 0189US4921038AProcess for preparing mold for investment castingSASAKI NOBUYOSHI·Filed 1989·Granted May 1, 1990·29 cites·4 claims
- 0283US4712605AProcess for producing hollow cast articleMCL CO LTD·Filed 1987·Granted Dec 15, 1987·25 cites·19 claims
- 0368US8647634B2Recombinant avian infectious coryza vaccine and process for preparing sameSAKAMOTO RYUICHI·Filed 2009·Granted Feb 11, 2014·0 cites·23 claims
- 0468US8471371B2Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor deviceBABA SUSUMU·Filed 2010·Granted Jun 25, 2013·3 cites·8 claims
- 0567US5200296AImage receiving material for silver complex diffusion transfer processMITSUBISHI PAPER MILLS LTD·Filed 1992·Granted Apr 6, 1993·8 cites·6 claims
- 0663US10767051B2Cured body and multilayered substrateSEKISUI CHEMICAL CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·10 claims
- 0759US4910129ASilver halide photographic light sensitive materialMITSUBISHI PAPER MILLS LTD·Filed 1988·Granted Mar 20, 1990·8 cites·5 claims
- 0859US4818676ASilver halide photographic emulsionMITSUBISHI PAPER MILLS LTD·Filed 1986·Granted Apr 4, 1989·8 cites·7 claims
- 0956US9324636B2Resin-sealed semiconductor device and associated wiring and support structureDAINIPPON PRINTING CO LTD·Filed 2014·Granted Apr 26, 2016·0 cites·3 claims
- 1054US4505098AYarn splicing apparatus for spun yarnsMURATA MACHINERY LTD·Filed 1984·Granted Mar 19, 1985·9 cites·8 claims
- 1153US8148804B2Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor deviceBABA SUSUMU·Filed 2009·Granted Apr 3, 2012·0 cites·9 claims
- 1250US12139576B2Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring boardSEKISUI CHEMICAL CO LTD·Filed 2019·Granted Nov 12, 2024·0 cites·14 claims
- 1350US11873398B2Interlayer insulating material and multilayer printed wiring boardSEKISUI CHEMICAL CO LTD·Filed 2017·Granted Jan 16, 2024·0 cites·10 claims
- 1450US8796832B2Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor deviceBABA SUSUMU·Filed 2012·Granted Aug 5, 2014·0 cites·9 claims
- 1550US2013183330A1Recombinant avian infectious coryza vaccine and process for preparing sameSAKAMOTO RYUICHI·Filed 2012·Application pending·0 cites
- 1646US7275005B2Worked product appearance inspection method and system thereforeDAINIPPON PRINTING CO LTD·Filed 2003·Granted Sep 25, 2007·10 cites·8 claims
- 1744US2019031822A1Resin composition and multilayer substrateSEKISUI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1842US2022169827A1Resin material and multilayer printed wiring boardSEKISUI CHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 1941US5102770AMethod for production of photosensitive material for diffusion transfer processMITSUBISHI PAPER MILLS LTD·Filed 1989·Granted Apr 7, 1992·3 cites·4 claims
- 2038US2018213635A1Resin composition and multilayer substrateSEKISUI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 2134US5041354APhotosensitive material for transfer processMITSUBISHI PAPER MILLS LTD·Filed 1989·Granted Aug 20, 1991·1 cites·6 claims
- 2234US4863843ASilver halide photographic emulsion containing predominantly silver bromideMITSUBISHI PAPER MILLS LTD·Filed 1985·Granted Sep 5, 1989·3 cites·13 claims
- 2333US5049475AMethod for production of photosensitive material for diffusion transfer processMITSUBISHI PAPER MILLS LTD·Filed 1989·Granted Sep 17, 1991·1 cites·7 claims
- 2431US5057395ASilver complex diffusion transfer processMITSUBISHI PAPER MILLS LTD·Filed 1989·Granted Oct 15, 1991·2 cites·10 claims
- 2526US5202219AImage receiving material for silver complex diffusion transfer with uppermost layerMITSUBISHI PAPER MILLS LTD·Filed 1991·Granted Apr 13, 1993·0 cites·8 claims
- 2624US5660972AMethod for photographic development using a filter to inhibit occurrence of silver sludgesMITSUBISHI PAPER MILLS LTD·Filed 1995·Granted Aug 26, 1997·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →