Inventor · disambiguated record
Suan Jeung Boon
Also filed as: BOON SUAN JEUNG
53 granted patents·5 pending applications·1,353 citations·filing 2000–2021
99Inventor score
Top patents by PatentIndex Score
58 records- 0199US7855462B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 21, 2010·148 cites·23 claims
- 0299US7646102B2Wafer level pre-packaged flip chip systemsMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 12, 2010·114 cites·25 claims
- 0398US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0497US6882021B2Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a leadMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·157 cites·38 claims
- 0596US7193312B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·32 cites·13 claims
- 0696US6710454B1Adhesive layer for an electronic apparatus having multiple semiconductor devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 23, 2004·79 cites·23 claims
- 0794US8106488B2Wafer level packagingCHUA SWEE KWANG·Filed 2010·Granted Jan 31, 2012·18 cites·18 claims
- 0894US7791203B2Interconnects for packaged semiconductor devices and methods for manufacturing such devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 7, 2010·26 cites·18 claims
- 0994US7633159B2Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·26 cites·27 claims
- 1093US8065792B2Method for packaging circuitsCHIA YONG POO·Filed 2010·Granted Nov 29, 2011·13 cites·18 claims
- 1193US7820484B2Wafer level packagingMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·20 cites·48 claims
- 1293US7208335B2Castellated chip-scale packages and methods for fabricating the sameMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 24, 2007·62 cites·72 claims
- 1392US7375009B2Method of forming a conductive via through a waferMICRON TECHNOLOGY INC·Filed 2002·Granted May 20, 2008·51 cites·35 claims
- 1492US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 1591US7173330B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 6, 2007·17 cites·21 claims
- 1690US7843050B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 30, 2010·12 cites·18 claims
- 1790US7674655B2Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding materialMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·15 cites·24 claims
- 1890US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 1988US7943422B2Wafer level pre-packaged flip chipMICRON TECHNOLOGY INC·Filed 2006·Granted May 17, 2011·9 cites·51 claims
- 2088US7812447B2Wafer level pre-packaged flip chipMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 12, 2010·10 cites·14 claims
- 2187US8555495B2Method for packaging circuitsCHIA YONG POO·Filed 2011·Granted Oct 15, 2013·6 cites·20 claims
- 2287US7808112B2Wafer level pre-packaged flip chip systemMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 5, 2010·9 cites·16 claims
- 2387US7274094B2Leadless packaging for image sensor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 25, 2007·39 cites·24 claims
- 2486US9165910B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 20, 2015·4 cites·18 claims
- 2586US7712211B2Method for packaging circuits and packaged circuitsMICRON TECHNOLOGY INC·Filed 2003·Granted May 11, 2010·26 cites·25 claims
- 2686US6958537B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·32 cites·18 claims
- 2785US7579681B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 25, 2009·28 cites·21 claims
- 2884US7884007B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 8, 2011·8 cites·22 claims
- 2984US7368374B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2004·Granted May 6, 2008·24 cites·36 claims
- 3084US6987031B2Multiple chip semiconductor package and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 17, 2006·27 cites·32 claims
- 3183US8063493B2Semiconductor device assemblies and packagesBOON SUAN JEUNG·Filed 2009·Granted Nov 22, 2011·9 cites·20 claims
- 3283US7915711B2Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor dieMICRON TECHNOLOGY INC·Filed 2010·Granted Mar 29, 2011·5 cites·19 claims
- 3382US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 3481US7112471B2Leadless packaging for image sensor devices and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·27 cites·26 claims
- 3579US8304894B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Nov 6, 2012·6 cites·31 claims
- 3679US8232657B2Packaged semiconductor assemblies and methods for manufacturing such assembliesBOON SUAN JEUNG·Filed 2010·Granted Jul 31, 2012·3 cites·10 claims
- 3779US8198720B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2010·Granted Jun 12, 2012·3 cites·11 claims
- 3879US7304375B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 4, 2007·5 cites·12 claims
- 3978US8564106B2Wafer level packagingCHUA SWEE KWANG·Filed 2012·Granted Oct 22, 2013·3 cites·20 claims
- 4077US9911696B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 6, 2018·2 cites·18 claims
- 4177US8525320B2Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2011·Granted Sep 3, 2013·4 cites·18 claims
- 4276US2022013460A1Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 4373US9653444B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted May 16, 2017·1 cites·14 claims
- 4472US2020243444A1Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 4571US8906744B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 9, 2014·1 cites·18 claims
- 4669US8536702B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2012·Granted Sep 17, 2013·1 cites·13 claims
- 4769US7271027B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 18, 2007·2 cites·18 claims
- 4867US8698295B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Apr 15, 2014·2 cites·20 claims
- 4965US10396059B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 27, 2019·0 cites·20 claims
- 5064US10622308B2Packaged semiconductor assemblies and methods for manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →