Inventor · disambiguated record
Sung Hyun Byun
Also filed as: BYUN SUNG HYUN
44 granted patents·35 pending applications·35 citations·filing 2014–2025
96Inventor score
Top patents by PatentIndex Score
79 records- 0197US11145788B2Micro LED transfer headPOINT ENGINEERING CO LTD·Filed 2020·Granted Oct 12, 2021·6 cites·10 claims
- 0296US11691387B2Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·7 claims
- 0389US11497126B2Multilayer wiring board and probe card including samePOINT ENGINEERING CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·9 claims
- 0489US10533253B2Fluid permeable anodic oxide film and fluid permeable body using anodic oxide filmPOINT ENGINEERING CO LTD·Filed 2016·Granted Jan 14, 2020·2 cites·9 claims
- 0588US11581210B2Micro LED transfer systemPOINT ENGINEERING CO LTD·Filed 2019·Granted Feb 14, 2023·4 cites·5 claims
- 0686US10634634B2Micro sensor package and manufacturing method of micro sensor packagePOINT ENGINEERING CO LTD·Filed 2017·Granted Apr 28, 2020·4 cites·13 claims
- 0785US10886446B2Micro LED structure and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2019·Granted Jan 5, 2021·4 cites·1 claims
- 0881US12151461B2Manufacturing method of anodic oxide film structure and anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·2 claims
- 0980US12296378B2Method of manufacturing metal product and mold used thereforPOINT ENGINEERING CO LTD·Filed 2024·Granted May 13, 2025·0 cites·8 claims
- 1080US10015841B2Micro heater and micro sensor and manufacturing methods thereofPOINT ENGINEERING CO LTD·Filed 2015·Granted Jul 3, 2018·3 cites·18 claims
- 1178US11217464B2System for transferring micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Jan 4, 2022·2 cites·18 claims
- 1277US10840115B2Micro LED transfer headPOINT ENGINEERING CO LTD·Filed 2019·Granted Nov 17, 2020·2 cites·3 claims
- 1375US11651904B2Multilayer ceramic substrate and probe card including samePOINT ENGINEERING CO LTD·Filed 2022·Granted May 16, 2023·0 cites·5 claims
- 1475US10241094B2Micro heater, micro sensor and micro sensor manufacturing methodPOINT ENGINEERING CO LTD·Filed 2016·Granted Mar 26, 2019·2 cites·6 claims
- 1574US11535001B2Manufacturing method of anodic oxide film structure and anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2020·Granted Dec 27, 2022·0 cites·2 claims
- 1671US11337347B2System for transferring micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted May 17, 2022·1 cites·12 claims
- 1770US2025264526A1Interposer and inspection apparatus comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 1869US9567583B2Method for treating glioma using Tarbp2 expression inhibitorUNIV SUNGKYUNKWAN RES & BUS·Filed 2014·Granted Feb 14, 2017·1 cites·5 claims
- 1967US12270828B2Probe cardPOINT ENGINEERING CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·3 claims
- 2067US11437196B2Multilayer ceramic substrate and probe card including samePOINT ENGINEERING CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·6 claims
- 2165US12169212B2Probe head and probe card comprising samePOINT ENGINEERING CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·4 claims
- 2264US11061070B2Guide plate for probe card and manufacturing method thereof, and probe card having samePOINT ENGINEERING CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·9 claims
- 2362US11543432B2Probe head and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·5 claims
- 2462US11193955B2Guide plate for probe card and probe card having samePOINT ENGINEERING CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·9 claims
- 2561US11523504B2Anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2021·Granted Dec 6, 2022·0 cites·6 claims
- 2661US2024426872A1Metal product, method of manufacturing same, and test device having samePOINT ENGINEERING CO LTD·Filed 2024·Application pending·0 cites
- 2761US2025020690A1Guide member, inspection device, and electro-conductive contact pinPOINT ENGINEERING CO LTD·Filed 2024·Application pending·0 cites
- 2861US2024229287A1Anodized film structurePOINT ENGINEERING CO LTD·Filed 2022·Application pending·0 cites
- 2959US12506091B2Anodized film substrate base, anodized film substrate part having same, anodized film-based interposer having same, and semiconductor package having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Dec 23, 2025·0 cites·17 claims
- 3059US12493052B2Electrically conductive contact pin, inspection apparatus, and molded productPOINT ENGINEERING CO LTD·Filed 2021·Granted Dec 9, 2025·0 cites·8 claims
- 3159US2024226994A9Composite mold, metal molded article, and method for manufacturing samePOINT ENGINEERING CO LTD·Filed 2022·Application pending·0 cites
- 3258US11860192B2Probe head and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·8 claims
- 3358US2024055176A1Inductor and body part for inductorPOINT ENGINEERING CO LTD·Filed 2021·Application pending·0 cites
- 3458US2025213692A1Anti-hla-g chimeric antigen receptor, and use thereofHK INNO N CORP·Filed 2023·Application pending·0 cites
- 3557US12222370B2Probe head and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·5 claims
- 3657US11610937B2Micro LED group substrate, method of manufacturing same, micro LED display panel, and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2020·Granted Mar 21, 2023·0 cites·18 claims
- 3757US2025297013A1Hla-g-specific antibody and use thereofHK INNO N CORP·Filed 2023·Application pending·0 cites
- 3856US11342207B2Micro LED transfer headPOINT ENGINEERING CO LTD·Filed 2020·Granted May 24, 2022·0 cites·8 claims
- 3955US11619655B2Probe card for testing a pattern formed on a waferPOINT ENGINEERING CO LTD·Filed 2020·Granted Apr 4, 2023·0 cites·13 claims
- 4055US2025199032A1Metal molded article, manufacturing method therefor, and inspection device having samePOINT ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 4154US10539526B2Micro sensorPOINT ENGINEERING CO LTD·Filed 2017·Granted Jan 21, 2020·0 cites·20 claims
- 4253US10433370B2Micro multi-array heater and micro multi-array sensorPOINT ENGINEERING CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·17 claims
- 4353US2024274564A1Micro bump, interposer for electrical connection having same, semiconductor package, multi-layer stacked semiconductor device, and displayPOINT ENGINEERING CO LTD·Filed 2022·Application pending·0 cites
- 4453US2024426871A1Vertical probe cardPOINT ENGINEERING CO LTD·Filed 2022·Application pending·0 cites
- 4552US10889009B2Transfer headPOINT ENGINEERING CO LTD·Filed 2019·Granted Jan 12, 2021·0 cites·4 claims
- 4652US2024112968A1Anodic aluminum oxide film-based interposer for electrical connection and manufacturing method therefor, semiconductor package and manufacturing method therefor, multi-stacked semiconductor device and manufacturing method therefor, display and manufacturing method thereforPOINT ENGINEERING CO LTD·Filed 2022·Application pending·0 cites
- 4752US2024280609A1Electrically conductive contact pinPOINT ENGINEERING CO LTD·Filed 2022·Application pending·0 cites
- 4851US10879105B2Micro LED transfer head and system using same for transferring micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·3 claims
- 4951US2021238763A1Laminated anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2020·Application pending·0 cites
- 5051US2025020691A1Electro-conductive contact pin, manufacturing method therefor, and electro-conductive contact pin modulePOINT ENGINEERING CO LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →