Inventor · disambiguated record
Su Chun-Jen
Also filed as: CHUN-JEN SU
3 granted patents·1 pending application·674 citations·filing 2000–2001
81Inventor score
Technology areasH10W
Files withWALSIN ADVANCED ELECTRONICS4
Top patents by PatentIndex Score
4 records- 0194US6337510B1Stackable QFN semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 2000·Granted Jan 8, 2002·353 cites·4 claims
- 0293US6459148B1QFN semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 2000·Granted Oct 1, 2002·214 cites·7 claims
- 0387US6385049B1Multi-board BGA packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted May 7, 2002·107 cites·13 claims
- 0430US2002173074A1Method for underfilling bonding gap between flip-chip and circuit substrateWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →