Inventor · disambiguated record
Sung-Yi Hsiao
Also filed as: HSIAO SUNG-YI
5 granted patents·14 pending applications·20 citations·filing 2008–2011
73Inventor score
Top patents by PatentIndex Score
19 records- 0188US8555492B2Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approachWANG BILY·Filed 2011·Granted Oct 15, 2013·9 cites·4 claims
- 0267US8263876B2Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the sameWANG BILY·Filed 2009·Granted Sep 11, 2012·0 cites·16 claims
- 0360US7923747B2Wafer level LED package structure and method for making the sameHARVATEK CORP·Filed 2008·Granted Apr 12, 2011·2 cites·8 claims
- 0455USD645421SLED baseHARVATEK CORP·Filed 2011·Granted Sep 20, 2011·9 cites·1 claims
- 0553US2010127292A1Wafer level led package structure for increasing light-emitting efficiency and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 0653US2009230538A1Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 0752US2012009699A1Wafer level led package structure for increase light-emitting efficiency and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 0850US8053885B2Wafer level vertical diode package structure and method for making the sameHARVATEK CORP·Filed 2009·Granted Nov 8, 2011·0 cites·11 claims
- 0950US2010264435A1White light-emitting diode package structure for simplifying package process and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1046US2012122254A1White light-emitting diode package structure for simplifying package process and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1145US2011003434A1Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2010·Application pending·0 cites
- 1245US2009283881A1Semiconductor chip package structure for achieving face-down electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 1345US2009278159A1Semiconductor chip package structure without substrates for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 1445US2011304020A1Wafer level diode package structureWANG BILY·Filed 2011·Application pending·0 cites
- 1539US2011147774A1Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the sameHARVATEK CORP·Filed 2010·Application pending·0 cites
- 1638US2012119231A1Led package structure with a deposited-type phosphor layer and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1738US2012106171A1Led package structureWANG BILY·Filed 2011·Application pending·0 cites
- 1837US2012037937A1Led package structure and method of making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1936US2011215357A1Led package structure and method of manufacturing the sameHARVATEK CORP·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →