Inventor · disambiguated record
Su-Jung Hyung
Also filed as: HYUNG SU JUNG
3 granted patents·2 pending applications·2 citations·filing 2016–2023
52Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0172US10068878B2Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCBSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 4, 2018·2 cites·19 claims
- 0259US11205637B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 0353US10797021B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 0447US2024047292A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0529US2019043777A1Semiconductor package for increasing heat radiation efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →