Inventor · disambiguated record
Sung-Il Kang
Also filed as: KANG SUNG W · KANG SUNG-IL
22 granted patents·10 pending applications·197 citations·filing 1999–2024
94Inventor score
Files withHAESUNG DS CO LTD15SAMSUNG ELECTRONICS CO LTD5SAMSUNG TECHWIN CO LTD3SHIM CHANG-HAN3KANG SUNG IL2
Top patents by PatentIndex Score
32 records- 0189US6475646B2Lead frame and method of manufacturing the lead frameSAMSUNG TECHWIN CO LTD·Filed 2000·Granted Nov 5, 2002·67 cites·9 claims
- 0279US8354741B2Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor packageSAMSUNG TECHWIN CO LTD·Filed 2012·Granted Jan 15, 2013·5 cites·11 claims
- 0375US6469386B1Lead frame and method for plating the sameSAMSUNG AEROSPACE IND·Filed 2000·Granted Oct 22, 2002·23 cites·7 claims
- 0474US7454539B2Method for transferring variable isochronous data and apparatus thereforeSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·5 cites·7 claims
- 0573US7285845B2Lead frame for semiconductor packageSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Oct 23, 2007·10 cites·20 claims
- 0672US9460986B2Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2015·Granted Oct 4, 2016·3 cites·9 claims
- 0771US8409726B2Printed circuit board with multiple metallic layers and method of manufacturing the sameSHIM CHANG-HAN·Filed 2009·Granted Apr 2, 2013·5 cites·9 claims
- 0868US10910299B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the methodHAESUNG DS CO LTD·Filed 2018·Granted Feb 2, 2021·1 cites·18 claims
- 0967US7155543B2Method for transferring variable isochronous data and apparatus thereforSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 26, 2006·9 cites·6 claims
- 1066US6150713ALead frame for semiconductor package and lead frame plating methodSAMSUNG AEROSPACE IND·Filed 1999·Granted Nov 21, 2000·36 cites·17 claims
- 1161US11876012B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·21 claims
- 1259US10840170B2Semiconductor package substrate and method for manufacturing sameHAESUNG DS CO LTD·Filed 2020·Granted Nov 17, 2020·0 cites·7 claims
- 1358US8278564B2Circuit board viaholes and method of manufacturing the sameSHIM CHANG-HAN·Filed 2009·Granted Oct 2, 2012·2 cites·6 claims
- 1458US2025006508A1Method of manufacturing lead frameHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 1558US2025140661A1Lead frame, semiconductor package including the same, and method of manufacturing the lead frameHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 1655US12341086B2Lead frameHAESUNG DS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·4 claims
- 1751US11854830B2Method of manufacturing circuit boardHAESUNG DS CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·19 claims
- 1851US10643932B2Semiconductor package substrate and method for manufacturing sameHAESUNG DS CO LTD·Filed 2016·Granted May 5, 2020·0 cites·11 claims
- 1951US6611886B1Method for transferring variable isochronous data and apparatus thereforSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Aug 26, 2003·19 cites·10 claims
- 2051US2012279775A1Circuit board viaholes and method of manufacturing the sameSHIM CHANG-HAN·Filed 2012·Application pending·0 cites
- 2148US2022274223A1Apparatus for grinding surface of substrateHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 2247US2022285251A1Semiconductor package substrate and method of manufacturing the same, and semiconductor package and method of manufacturing the sameHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 2347US2007131001A1Drum type washing machine and method for assembling shaft systemSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2447US2023080101A1Semiconductor package substrate, method of manufacturing the same, and semiconductor packageHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 2546US11227775B2Method of fabricating carrier for wafer level package by using lead frameHAESUNG DS CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 2646US9598220B2Cosmetic container with different types of mixed materialsAMOREPACIFIC CORP·Filed 2013·Granted Mar 21, 2017·0 cites·10 claims
- 2746US2007002874A1Method for distributing stream data based on multi-path scheme using tcp in real timeKANG YONG-IL·Filed 2004·Application pending·0 cites
- 2844US10643933B2Semiconductor package substrate and manufacturing method thereforHAESUNG DS CO LTD·Filed 2016·Granted May 5, 2020·0 cites·9 claims
- 2944US8110505B2Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor packageKANG SUNG-IL·Filed 2009·Granted Feb 7, 2012·0 cites·9 claims
- 3041US2021107094A1Apparatus for and method of polishing surface of substrateHAESUNG DS CO LTD·Filed 2020·Application pending·0 cites
- 3139US2008116229A1Cometic Bottle Structure for Discharging Fixed Quantity of Highly Viscosity CosmeticsKANG SUNG IL·Filed 2005·Application pending·0 cites
- 3233US6667987B1Method of extending channels for IEEE-1394 serial busSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 23, 2003·12 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →