Inventor · disambiguated record
Sunmi Kim
Also filed as: KIM SUNMI
17 granted patents·4 pending applications·98 citations·filing 2003–2023
92Inventor score
Top patents by PatentIndex Score
21 records- 0197US7906371B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldSTATS CHIPPAC LTD·Filed 2008·Granted Mar 15, 2011·64 cites·24 claims
- 0292US11529655B2Nozzle, substrate processing apparatus including the same, and substrate processing methodSEMES CO LTD·Filed 2020·Granted Dec 20, 2022·3 cites·19 claims
- 0388US11897005B2Nozzle, substrate processing apparatus including the same, and substrate processing methodSEMES CO LTD·Filed 2022·Granted Feb 13, 2024·1 cites·13 claims
- 0486US8421201B2Integrated circuit packaging system with underfill and methods of manufacture thereofLEE KYUNGHOON·Filed 2009·Granted Apr 16, 2013·13 cites·16 claims
- 0585US11649206B2Method for producing pyrrole compoundTAKEDA PHARMACEUTICALS CO·Filed 2021·Granted May 16, 2023·1 cites·16 claims
- 0682US12202797B2Method for producing pyrrole compoundTAKEDA PHARMACEUTICALS CO·Filed 2023·Granted Jan 21, 2025·0 cites·17 claims
- 0780US8264059B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldKIM OHHAN·Filed 2011·Granted Sep 11, 2012·4 cites·18 claims
- 0879US10570091B2Method for producing pyrrole compoundTAKEDA PHARMACEUTICALS CO·Filed 2016·Granted Feb 25, 2020·1 cites·11 claims
- 0979US9543258B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldSTATS CHIPPAC LTD·Filed 2016·Granted Jan 10, 2017·2 cites·25 claims
- 1078US11066362B2Method for producing pyrrole compoundTAKEDA PHARMACEUTICALS CO·Filed 2020·Granted Jul 20, 2021·1 cites·16 claims
- 1170US10979645B2Video capturing device including cameras and video capturing system including the sameHANWHA TECHWIN CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 1268US8682329B2Method of performing handover between heterogeneous networks and user equipment apparatus for the sameKIM SUNMI·Filed 2012·Granted Mar 25, 2014·4 cites·10 claims
- 1365US9293349B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldKIM OHHAN·Filed 2012·Granted Mar 22, 2016·1 cites·25 claims
- 1462US9053953B1Integrated circuit packaging system with underfill and method of manufacture thereofLEE KYUNGHOON·Filed 2013·Granted Jun 9, 2015·1 cites·20 claims
- 1550US9574295B2Washing machine and method of controlling sameLG ELECTRONICS INC·Filed 2014·Granted Feb 21, 2017·0 cites·17 claims
- 1649US8137995B2Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structuresKIM OHHAN·Filed 2008·Granted Mar 20, 2012·0 cites·21 claims
- 1747US2011216312A1Semiconductor inspection device and inspection methodHAMAMATSU PHOTONICS KK·Filed 2009·Application pending·0 cites
- 1844US2012153452A1Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect StructuresKIM OHHAN·Filed 2012·Application pending·0 cites
- 1943US2008315406A1Integrated circuit package system with cavity substrateCHUNG JAE HAN·Filed 2007·Application pending·0 cites
- 2042US7229495B2Silicon wafer and method for producing silicon single crystalSILTRON INC·Filed 2003·Granted Jun 12, 2007·0 cites·31 claims
- 2131US2012190402A1Dual mode mobile terminal in wireless communication system and controlling method thereofWHANG YONGNAM·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →