Inventor · disambiguated record
Sukwon Lee
Also filed as: LEE SUKWON
8 granted patents·4 pending applications·20 citations·filing 2009–2025
80Inventor score
Top patents by PatentIndex Score
12 records- 0192US11607741B2Semiconductor chip bonding apparatus including head having thermally conductive materialsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 21, 2023·7 cites·20 claims
- 0288US9553069B2Bonding apparatus and substrate manufacturing equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 24, 2017·10 cites·19 claims
- 0380US10312196B2Semiconductor packages including indicators for evaluating a distance and methods of calculating the distanceSK HYNIX INC·Filed 2018·Granted Jun 4, 2019·3 cites·13 claims
- 0468US11848301B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 19, 2023·0 cites·20 claims
- 0561US2025379091A1Manufacturing method for semiconductor using warpage compensation wafer and manufacturing method for warpage compensation waferSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0660US11626381B2Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 0760US11239177B2Semiconductor packages including die over-shift indicating patternsSK HYNIX INC·Filed 2020·Granted Feb 1, 2022·0 cites·6 claims
- 0859US2025369112A1Atomic layer deposition apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0955US10692816B2Semiconductor packages including die over-shift indicating patternsSK HYNIX INC·Filed 2018·Granted Jun 23, 2020·0 cites·11 claims
- 1045US2011105622A1Pharmaceutical composition containing glur2-lacking ampar antagonist for preventing or treating psychiatric illnessesSNU R&DB FOUNDATION·Filed 2009·Application pending·0 cites
- 1141US8835503B2Pharmaceutical composition containing GLUR2-lacking AMPAR antagonist for preventing or treating psychiatric illnessesSNU R&DB FOUNDATION·Filed 2012·Granted Sep 16, 2014·0 cites·2 claims
- 1225US2012174394A1Method for manufacturing multilayer circuit boardCHANG TAE-EUN·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sukwon Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →