Inventor · disambiguated record
Susumu Maniwa
Also filed as: MANIWA SUSUMU
14 granted patents·1 pending application·5 citations·filing 2009–2022
84Inventor score
Top patents by PatentIndex Score
15 records- 0162US8319322B2Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor deviceTODA JUNKO·Filed 2011·Granted Nov 27, 2012·2 cites·2 claims
- 0261US8703598B2Manufacturing method of lead frame substrateTOPPAN PRINTING CO LTD·Filed 2013·Granted Apr 22, 2014·1 cites·4 claims
- 0361US8535987B2Method of manufacturing substrate for semiconductor element, and semiconductor deviceMANIWA SUSUMU·Filed 2011·Granted Sep 17, 2013·2 cites·3 claims
- 0453US12317411B2Glass core wiring substrate incorporating high-frequency filter, high-frequency module using the same, and method of manufacturing glass core wiring substrate incorporating high-frequency filterTOPPAN INC·Filed 2022·Granted May 27, 2025·0 cites·11 claims
- 0553US12101074B2Multilayer circuit board with LC resonant circuit and electronic component package including multilayer circuit board with LC resonant circuitTOPPAN INC·Filed 2021·Granted Sep 24, 2024·0 cites·9 claims
- 0651US12456697B2Multilayer wiring substrate and module having multilayer wiring substrateTOPPAN INC·Filed 2022·Granted Oct 28, 2025·0 cites·8 claims
- 0750US8546940B2Manufacturing method of lead frame substrate and semiconductor apparatusMANIWA SUSUMU·Filed 2009·Granted Oct 1, 2013·0 cites·4 claims
- 0849US11877394B2Glass core multilayer wiring board and method of producing the sameTOPPAN INC·Filed 2022·Granted Jan 16, 2024·0 cites·16 claims
- 0948US8535979B2Method for manufacturing substrate for semiconductor elementTOPPAN PRINTING CO LTD·Filed 2012·Granted Sep 17, 2013·0 cites·1 claims
- 1044US11303261B2Circuit boardTOPPAN PRINTING CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·17 claims
- 1143US8390105B2Lead frame substrate, manufacturing method thereof, and semiconductor apparatusTODA JUNKO·Filed 2009·Granted Mar 5, 2013·0 cites·3 claims
- 1236US8466547B2Method for manufacturing substrate for semiconductor element, and semiconductor deviceMANIWA SUSUMU·Filed 2011·Granted Jun 18, 2013·0 cites·6 claims
- 1335US8558363B2Lead frame substrate and method of manufacturing the same, and semiconductor deviceTSUKAMOTO TAKEHITO·Filed 2011·Granted Oct 15, 2013·0 cites·3 claims
- 1434US2012061809A1Method for manufacturing substrate for semiconductor element, and semiconductor deviceTODA JUNKO·Filed 2011·Application pending·0 cites
- 1532US8304294B2Lead frame substrate and method of manufacturing the sameTSUKAMOTO TAKEHITO·Filed 2011·Granted Nov 6, 2012·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →