Inventor · disambiguated record
Sunghwan Min
Also filed as: MIN SUNGHWAN
2 granted patents·7 pending applications·0 citations·filing 2014–2025
23Inventor score
Top patents by PatentIndex Score
9 records- 0159US12498527B2Packaging microLED optical interconnectsAVICENATECH CORP·Filed 2023·Granted Dec 16, 2025·0 cites·12 claims
- 0257US2025060544A1Fiber-optic bundles for parallel optical interconnectsROURKE HOWARD·Filed 2024·Application pending·0 cites
- 0357US2025110299A1Optically interconnected processor and memory modulesAVICENATECH CORP·Filed 2024·Application pending·0 cites
- 0453US2024345344A1Optically interconnected high bandwidth memory architecturesMIN SUNGHWAN·Filed 2024·Application pending·0 cites
- 0552US2024385394A1Enhanced micro-optical structures for parallel microled linksPOCOCK ROWAN·Filed 2024·Application pending·0 cites
- 0648US2025301845A1Vertical optical io for multi-chip packagesKALMAN ROBERT·Filed 2025·Application pending·0 cites
- 0747US2025301850A1Optical interconnects using 3d stacked optoelectronic interfacesKALMAN ROBERT·Filed 2025·Application pending·0 cites
- 0836US9391032B2Integrated circuits with internal padsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 12, 2016·0 cites·15 claims
- 0928US2016276308A1Thermally enhanced package-on-package structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →