Inventor · disambiguated record
Suddhasattwa Nad
Also filed as: NAD SUDDHASATTWA
30 granted patents·134 pending applications·4 citations·filing 2015–2024
92Inventor score
Top patents by PatentIndex Score
164 records- 0183US12224103B2Angled inductor with small form factorINTEL CORP·Filed 2021·Granted Feb 11, 2025·1 cites·9 claims
- 0274US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 0373US11177232B2Circuit device with monolayer bonding between surface structuresINTEL CORP·Filed 2018·Granted Nov 16, 2021·2 cites·19 claims
- 0469US12002745B2High performance integrated RF passives using dual lithography processINTEL CORP·Filed 2021·Granted Jun 4, 2024·0 cites·5 claims
- 0566US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 0666US10410939B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2015·Granted Sep 10, 2019·1 cites·25 claims
- 0764US11528811B2Method, device and system for providing etched metallization structuresINTEL CORP·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 0859US12349282B2Capacitors in through glass viasINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 0959US10971416B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 1059US2025218982A1Technologies for ceramic components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1159US2025210495A1Microelectronic assemblies with selective metallization for glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1259US2024105571A1Implantation of species on glass core surface for low loss and high strength applicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 1359US2025218905A1Component coupled with conductive vias encapsulated in an electronic substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 1458US2025218962A1Technologies for a stack of components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1558US2025266395A1Multi-die bridge assemblies and methods for three-dimensional packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 1658US2025112100A1Die embedded in glass layer with two-side connectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 1757US2025096053A1Microelectronic assemblies having a bridge die over a glass patchINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2025293172A1Semiconductor package with bridge die over embedded interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 1957US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2057US2025273582A1Interconnections to package substrates for interconnect bridgesINTEL CORP·Filed 2024·Application pending·0 cites
- 2156US12255147B2Electronic substrate having an embedded etch stop to control cavity depth in glass layers thereinINTEL CORP·Filed 2021·Granted Mar 18, 2025·0 cites·24 claims
- 2256US2025201732A1Microelectronic assemblies with crack-healing materials for glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2356US2025006781A1Carbon nanofiber capacitor apparatus and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2456US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2556US2025006671A1Semiconductor layer with dry deposition layerINTEL CORP·Filed 2023·Application pending·0 cites
- 2656US2025210469A1Mixed depth cavity for embedded bridge structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 2755US12159825B2Dielectric-to-metal adhesion promotion materialINTEL CORP·Filed 2021·Granted Dec 3, 2024·0 cites·20 claims
- 2855US2024332195A1Spray-coated photoresist and photoimageable dielectrics to enable tsv bridge for glass core packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2955US2024178207A1Photonic integrated circuit packages including substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 3055US2024222298A1Technologies for die recycling for high yield packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 3155US2025105209A1High performance microelectronic assemblies including through-silicon via bridges with top die first approachINTEL CORP·Filed 2023·Application pending·0 cites
- 3255US2024224543A1Stacked multichip ic device packages including a glass substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 3355US2025112165A1Anisotropic conductive connections for interconnect bridges and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3455US2024213235A1Architectures for backside power delivery with stacked integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3555US2024170351A1Redistribution layers in a dielectric cavity to enable an embedded componentINTEL CORP·Filed 2022·Application pending·0 cites
- 3655US2025105222A1High performance microelectronic assemblies including through-silicon via bridges with top die last approachINTEL CORP·Filed 2023·Application pending·0 cites
- 3755US2024222139A1Microelectronic package structures with solder joint assemblies having roughened bump structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 3855US2024194608A1Low z-height, glass-reinforced package with embedded bridgeINTEL CORP·Filed 2022·Application pending·0 cites
- 3955US2024290723A1Protection against electromigration within a layer of an integrated circuitINTEL CORP·Filed 2023·Application pending·0 cites
- 4055US2024128247A1Package architecture with glass core substrate having integrated inductorsINTEL CORP·Filed 2022·Application pending·0 cites
- 4155US2024222279A1Technologies for vertically interconnected glass core architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 4255US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4355US2024194548A1Apparatus and method for electroless surface finishing on glassINTEL CORP·Filed 2022·Application pending·0 cites
- 4455US2024222320A1Directly bonded multichip ic device packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 4555US2025183179A1Passive structures in embedded bridge architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 4655US2024194657A1Integrated photonic device and electronic device architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 4754US11817349B2Conductive route patterning for electronic substratesINTEL CORP·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 4854US2024176167A1Integrated optical phase change materials for reconfigurable optics in glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 4954US2024063127A1Conformable die bond film (dbf) in glass cavityINTEL CORP·Filed 2022·Application pending·0 cites
- 5054US2024087971A1Copper clad laminate (ccl) for plating pads within a glass cavity for glass core applicationsINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 164 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →