Inventor · disambiguated record
Suriyakala Ramalingam
Also filed as: RAMALINGAM SURIYAKALA · RAMALINGAM SURIYAKALA SURIYA
12 granted patents·7 pending applications·7 citations·filing 2012–2022
83Inventor score
Top patents by PatentIndex Score
19 records- 0169US8900919B2Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materialsINTEL CORP·Filed 2013·Granted Dec 2, 2014·2 cites·19 claims
- 0268US9431274B2Method for reducing underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2012·Granted Aug 30, 2016·2 cites·7 claims
- 0368US9330993B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyBAI YIQUN·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 0456US9640415B2Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materialsINTEL CORP·Filed 2014·Granted May 2, 2017·0 cites·14 claims
- 0551US11022792B2Coupling a magnet with a MEMS deviceINTEL CORP·Filed 2016·Granted Jun 1, 2021·0 cites·20 claims
- 0651US2024153837A1Barrier enabled cuf and mold process for multi-chip packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 0750US10115606B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyINTEL CORP·Filed 2016·Granted Oct 30, 2018·0 cites·23 claims
- 0848US10269695B2Method for forming an electrical device and electrical devicesINTEL CORP·Filed 2017·Granted Apr 23, 2019·0 cites·10 claims
- 0946US9691675B1Method for forming an electrical device and electrical devicesINTEL CORP·Filed 2015·Granted Jun 27, 2017·0 cites·15 claims
- 1046US2018342463A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2018·Application pending·0 cites
- 1145US2016343591A1Reduction of underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1243US2018190593A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1342US10317952B2Compartment for magnet placementINTEL CORP·Filed 2016·Granted Jun 11, 2019·0 cites·16 claims
- 1441US9704767B1Mold compound with reinforced fibersINTEL CORP·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 1538US10356912B2Apparatus and method for conformal coating of integrated circuit packagesINTEL CORP·Filed 2016·Granted Jul 16, 2019·0 cites·20 claims
- 1637US8895365B2Techniques and configurations for surface treatment of an integrated circuit substrateRAMALINGAM SURIYAKALA·Filed 2012·Granted Nov 25, 2014·0 cites·10 claims
- 1732US2018324955A1No-flow adhesive for second and third level interconnectsINTEL CORP·Filed 2015·Application pending·0 cites
- 1829US2016268213A1On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI RisksINTEL CORP·Filed 2015·Application pending·0 cites
- 1927US2017287799A1Removable ic package stiffenerKLEIN STEVEN A·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →