Inventor · disambiguated record
Suresh Ramalingam
Also filed as: RAMALINGAM SURESH · RAMALINGAM SURESH C
64 granted patents·12 pending applications·1,053 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
76 records- 0199US6687427B2Optic switchINTEL CORP·Filed 2000·Granted Feb 3, 2004·297 cites·19 claims
- 0298US11769710B2Heterogeneous integration module comprising thermal management apparatusXILINX INC·Filed 2020·Granted Sep 26, 2023·25 cites·20 claims
- 0398US11373989B1Package integration for laterally mounted IC dies with dissimilar solder interconnectsXILINX INC·Filed 2020·Granted Jun 28, 2022·6 cites·20 claims
- 0498US11107770B1Integrated electrical/optical interface with two-tiered packagingXILINX INC·Filed 2019·Granted Aug 31, 2021·70 cites·14 claims
- 0597US11373929B1Thermal heat spreader plate for electronic deviceXILINX INC·Filed 2020·Granted Jun 28, 2022·13 cites·20 claims
- 0697US11330738B1Force balanced package mountingXILINX INC·Filed 2020·Granted May 10, 2022·7 cites·18 claims
- 0797US11145566B2Stacked silicon package assembly having thermal managementXILINX INC·Filed 2020·Granted Oct 12, 2021·5 cites·20 claims
- 0897US9418966B1Semiconductor assembly having bridge module for die-to-die interconnectionXILINX INC·Filed 2015·Granted Aug 16, 2016·28 cites·12 claims
- 0997US9224697B1Multi-die integrated circuits implemented using spacer diesXILINX INC·Filed 2013·Granted Dec 29, 2015·55 cites·16 claims
- 1097US8946884B2Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) productXILINX INC·Filed 2013·Granted Feb 3, 2015·34 cites·23 claims
- 1196US11195780B1Stacked silicon package assembly having thermal management using phase change materialXILINX INC·Filed 2020·Granted Dec 7, 2021·4 cites·20 claims
- 1296US10529645B2Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal managementXILINX INC·Filed 2017·Granted Jan 7, 2020·26 cites·20 claims
- 1396US10262920B1Stacked silicon package having a thermal capacitance elementXILINX INC·Filed 2016·Granted Apr 16, 2019·24 cites·21 claims
- 1496US9812374B1Thermal management device with textured surface for extended cooling limitXILINX INC·Filed 2017·Granted Nov 7, 2017·18 cites·20 claims
- 1596US9006030B1Warpage management for fan-out mold packaged integrated circuitXILINX INC·Filed 2013·Granted Apr 14, 2015·47 cites·16 claims
- 1695US10043730B2Stacked silicon package assembly having an enhanced lidXILINX INC·Filed 2015·Granted Aug 7, 2018·19 cites·19 claims
- 1794US11488887B1Thermal enablement of dies with impurity getteringXILINX INC·Filed 2020·Granted Nov 1, 2022·5 cites·9 claims
- 1894US11246211B1Micro device with through PCB coolingXILINX INC·Filed 2021·Granted Feb 8, 2022·7 cites·20 claims
- 1993US12136613B2Chip package with near-die integrated passive deviceXILINX INC·Filed 2022·Granted Nov 5, 2024·2 cites·20 claims
- 2093US9627329B1Interposer with edge reinforcement and method for manufacturing sameXILINX INC·Filed 2014·Granted Apr 18, 2017·16 cites·17 claims
- 2193US8618648B1Methods for flip chip stackingKWON WOON-SEONG·Filed 2012·Granted Dec 31, 2013·22 cites·18 claims
- 2292US10147664B2Dynamic mounting thermal management for devices on boardXILINX INC·Filed 2017·Granted Dec 4, 2018·10 cites·24 claims
- 2392US9245865B1Integrated circuit package with multi-trench structure on flipped substrate contacting underfillXILINX INC·Filed 2014·Granted Jan 26, 2016·14 cites·20 claims
- 2492US9147661B1Solder bump structure with enhanced high temperature aging reliability and method for manufacturing sameXILINX INC·Filed 2014·Granted Sep 29, 2015·15 cites·20 claims
- 2591US11605886B1Radome with integrated passive coolingXILINX INC·Filed 2020·Granted Mar 14, 2023·4 cites·21 claims
- 2691US11328976B1Three-dimensional thermal management apparatuses for electronic devicesXILINX INC·Filed 2020·Granted May 10, 2022·3 cites·10 claims
- 2791US11043484B1Method and apparatus of package enabled ESD protectionXILINX INC·Filed 2019·Granted Jun 22, 2021·8 cites·20 claims
- 2889US11476556B1Remote active cooling heat exchanger and antenna system with the sameXILINX INC·Filed 2020·Granted Oct 18, 2022·2 cites·20 claims
- 2989US11282775B1Chip package assembly with stress decoupled interconnect layerXILINX INC·Filed 2020·Granted Mar 22, 2022·2 cites·19 claims
- 3088US10720377B2Electronic device apparatus with multiple thermally conductive paths for heat dissipationXILINX INC·Filed 2018·Granted Jul 21, 2020·6 cites·20 claims
- 3187US7066657B2Optical subassemblyINTEL CORP·Filed 2000·Granted Jun 27, 2006·38 cites·6 claims
- 3285US10629512B2Integrated circuit die with in-chip heat sinkXILINX INC·Filed 2018·Granted Apr 21, 2020·4 cites·20 claims
- 3385US6486440B1Redundant package for optical componentsJDS UNIPHASE CORP·Filed 2001·Granted Nov 26, 2002·30 cites·30 claims
- 3480US11302674B2Modular stacked silicon package assemblyXILINX INC·Filed 2020·Granted Apr 12, 2022·1 cites·20 claims
- 3579US11315858B1Chip package assembly with enhanced solder resist crack resistanceXILINX INC·Filed 2020·Granted Apr 26, 2022·1 cites·20 claims
- 3678US11488936B2Stacked silicon package assembly having vertical thermal managementXILINX INC·Filed 2019·Granted Nov 1, 2022·2 cites·20 claims
- 3778US9831104B1Techniques for molded underfill for integrated circuit diesXILINX INC·Filed 2015·Granted Nov 28, 2017·3 cites·13 claims
- 3877US6927370B2Electromagnetic hemming machine and method for joining sheet metal layersDAIMLER CHRYSLER CORP·Filed 2003·Granted Aug 9, 2005·26 cites·12 claims
- 3975US10319606B1Chip package assembly with enhanced interconnects and method for fabricating the sameXILINX INC·Filed 2017·Granted Jun 11, 2019·2 cites·20 claims
- 4073US7141448B2Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materialsINTEL CORP·Filed 2001·Granted Nov 28, 2006·17 cites·13 claims
- 4169US11355412B2Stacked silicon package assembly having thermal managementXILINX INC·Filed 2018·Granted Jun 7, 2022·1 cites·18 claims
- 4268US6490166B1Integrated circuit package having a substrate vent holeINTEL CORP·Filed 1999·Granted Dec 3, 2002·30 cites·16 claims
- 4367US9508563B2Methods for flip chip stackingKWON WOON-SEONG·Filed 2012·Granted Nov 29, 2016·2 cites·20 claims
- 4466US6238948B1Controlled collapse chip connection (C4) integrated circuit package that has a fillet which seals an underfill materialINTEL CORP·Filed 1999·Granted May 29, 2001·30 cites·16 claims
- 4565US9236341B1Through-silicon vias with metal system fillKIM DONG W·Filed 2010·Granted Jan 12, 2016·3 cites·15 claims
- 4663US12324101B2Frame for coupling of a thermal management device to a printed circuit boardADVANCED MICRO DEVICES INC·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 4762US12463143B2Chip package with core embedded integrated devicesXILINX INC·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 4862US6697553B2Compact, low insertion loss, high yield arrayed waveguide gratingJDS UNIPHASE CORP·Filed 2002·Granted Feb 24, 2004·9 cites·78 claims
- 4960US12315781B2Heat spreader for a semiconductor packageXILINX INC·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 5060US6525922B2High performance via capacitor and method for manufacturing sameINTEL CORP·Filed 2000·Granted Feb 25, 2003·9 cites·25 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →