Inventor · disambiguated record
Sujatha Sankaran
Also filed as: SANKARAN SUJATHA
17 granted patents·1 pending application·159 citations·filing 2004–2011
94Inventor score
Top patents by PatentIndex Score
18 records- 0191US8129286B2Reducing effective dielectric constant in semiconductor devicesEDELSTEIN DANIEL C·Filed 2008·Granted Mar 6, 2012·11 cites·32 claims
- 0291US8056039B2Interconnect structure for integrated circuits having improved electromigration characteristicsIBM·Filed 2008·Granted Nov 8, 2011·23 cites·17 claims
- 0391US7892940B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Feb 22, 2011·11 cites·25 claims
- 0491US7405147B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2004·Granted Jul 29, 2008·35 cites·31 claims
- 0589US8343868B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2011·Granted Jan 1, 2013·6 cites·20 claims
- 0689US7371684B2Process for preparing electronics structures using a sacrificial multilayer hardmask schemeIBM·Filed 2005·Granted May 13, 2008·12 cites·21 claims
- 0787US7592685B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Sep 22, 2009·7 cites·20 claims
- 0884US7737528B2Structure and method of forming electrically blown metal fuses for integrated circuitsIBM·Filed 2008·Granted Jun 15, 2010·12 cites·20 claims
- 0983US7488679B2Interconnect structure and process of making the sameIBM·Filed 2006·Granted Feb 10, 2009·13 cites·30 claims
- 1079US7671362B2Test structure for determining optimal seed and liner layer thicknesses for dual damascene processingIBM·Filed 2007·Granted Mar 2, 2010·6 cites·7 claims
- 1179US7645700B2Dry etchback of interconnect contactsIBM·Filed 2007·Granted Jan 12, 2010·5 cites·22 claims
- 1278US7947907B2Electronics structures using a sacrificial multi-layer hardmask schemeIBM·Filed 2008·Granted May 24, 2011·5 cites·20 claims
- 1373US7776737B2Reliability of wide interconnectsIBM·Filed 2008·Granted Aug 17, 2010·5 cites·25 claims
- 1472US7394154B2Embedded barrier for dielectric encapsulationIBM·Filed 2005·Granted Jul 1, 2008·3 cites·5 claims
- 1568US7323410B2Dry etchback of interconnect contactsIBM·Filed 2005·Granted Jan 29, 2008·2 cites·8 claims
- 1664US8298948B2Capping of copper interconnect lines in integrated circuit devicesBONILLA GRISELDA·Filed 2009·Granted Oct 30, 2012·2 cites·20 claims
- 1763US7968456B2Method of forming an embedded barrier layer for protection from chemical mechanical polishing processIBM·Filed 2008·Granted Jun 28, 2011·1 cites·16 claims
- 1843US2007232048A1Damascene interconnection having a SiCOH low k layerMIYATA KOJI·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sujatha Sankaran files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →