Inventor · disambiguated record
Sungmin Song
Also filed as: SONG SUNGMIN
23 granted patents·1 pending application·269 citations·filing 2006–2023
96Inventor score
Top patents by PatentIndex Score
24 records- 0196US7919871B2Integrated circuit package system for stackable devicesSTATS CHIPPAC LTD·Filed 2008·Granted Apr 5, 2011·47 cites·12 claims
- 0296US7312519B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 25, 2007·50 cites·5 claims
- 0393US9330945B2Integrated circuit package system with multi-chip moduleSONG SUNGMIN·Filed 2007·Granted May 3, 2016·33 cites·14 claims
- 0492US7298037B2Stacked integrated circuit package-in-package system with recessed spacerSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·27 cites·15 claims
- 0591US7871861B2Stacked integrated circuit package system with intra-stack encapsulationSTATS CHIPPAC LTD·Filed 2008·Granted Jan 18, 2011·22 cites·19 claims
- 0690US7482203B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jan 27, 2009·18 cites·20 claims
- 0789US8765525B2Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposerYOON IN SANG·Filed 2011·Granted Jul 1, 2014·8 cites·9 claims
- 0886US8779562B2Integrated circuit packaging system with interposer shield and method of manufacture thereofLEE SEONGMIN·Filed 2011·Granted Jul 15, 2014·10 cites·18 claims
- 0984US9355962B2Integrated circuit package stacking system with redistribution and method of manufacture thereofLEE SEONGMIN·Filed 2009·Granted May 31, 2016·12 cites·9 claims
- 1082US9385066B1Integrated circuit packaging system with molded laser via interposer and method of manufacture thereofYOON IN SANG·Filed 2014·Granted Jul 5, 2016·4 cites·10 claims
- 1181US8227925B2Integrated circuit packaging system with interposerSONG SUNGMIN·Filed 2012·Granted Jul 24, 2012·5 cites·10 claims
- 1277US9234038B2Compositions and method for the diagnosis, prevention and treatment of alzheimer's diseaseJUNG YONG-KEUN·Filed 2012·Granted Jan 12, 2016·4 cites·1 claims
- 1377US8130512B2Integrated circuit package system and method of package stackingYOON IN SANG·Filed 2008·Granted Mar 6, 2012·6 cites·20 claims
- 1476US8569882B2Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereofKO WONJUN·Filed 2011·Granted Oct 29, 2013·5 cites·17 claims
- 1574US8124358B2Methods of screening for compounds that inhibit binding between amyloid-β(Aβ) and FC-γ receptor IIB (FcγRIIb)JUNG YONG-KEUN·Filed 2007·Granted Feb 28, 2012·1 cites·7 claims
- 1673US7667314B2Integrated circuit package system with mold lock subassemblySTATS CHIPPAC LTD·Filed 2007·Granted Feb 23, 2010·5 cites·20 claims
- 1769US8772916B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2012·Granted Jul 8, 2014·2 cites·5 claims
- 1869US8124451B2Integrated circuit packaging system with interposerSONG SUNGMIN·Filed 2007·Granted Feb 28, 2012·4 cites·10 claims
- 1968US10083903B1Integrated circuit packaging system with molded laser via interposer and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Sep 25, 2018·1 cites·20 claims
- 2067US8252615B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2006·Granted Aug 28, 2012·3 cites·10 claims
- 2162US8501535B2Integrated circuit package system with dual side connection and method for manufacturing thereofSONG SUNGMIN·Filed 2011·Granted Aug 6, 2013·1 cites·18 claims
- 2256US8618653B2Integrated circuit package system with wafer scale heat slugKO WONJUN·Filed 2008·Granted Dec 31, 2013·1 cites·20 claims
- 2354US2024216462A1Pharmaceutical composition for enhancing immunity or anti-cancer activity including extract of pseudolysimachion nakaianum (ohwi) t.yamaz as active ingredientKOREA INST SCI & TECH·Filed 2023·Application pending·0 cites
- 2450US7884457B2Integrated circuit package system with dual side connectionSTATS CHIPPAC LTD·Filed 2007·Granted Feb 8, 2011·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →