Inventor · disambiguated record
Su Tao
Also filed as: TAO SU
77 granted patents·22 pending applications·2,452 citations·filing 1994–2007
99Inventor score
Top patents by PatentIndex Score
99 records- 0197US7321168B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 22, 2008·55 cites·16 claims
- 0296US6258626B1Method of making stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 10, 2001·152 cites·16 claims
- 0396US6252305B1Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 26, 2001·137 cites·2 claims
- 0495US7002805B2Thermal enhance MCM package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 21, 2006·112 cites·12 claims
- 0594US6462421B1Multichip moduleADVANCED SEMICONDCUTOR ENGINEE·Filed 2000·Granted Oct 8, 2002·148 cites·10 claims
- 0694US6359340B1Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 19, 2002·109 cites·15 claims
- 0793US6461897B2Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Oct 8, 2002·75 cites·3 claims
- 0890US6809852B2Microsystem package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Oct 26, 2004·49 cites·14 claims
- 0990US6229702B1Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capabilityADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted May 8, 2001·123 cites·19 claims
- 1090US6118176AStacked chip assembly utilizing a lead frameADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Sep 12, 2000·153 cites·3 claims
- 1189US6191360B1Thermally enhanced BGA packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 20, 2001·109 cites·6 claims
- 1287US6822324B2Wafer-level package with a cavity and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 23, 2004·48 cites·26 claims
- 1387US6215193B1Multichip modules and manufacturing method thereforADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Apr 10, 2001·97 cites·8 claims
- 1486US7291926B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 6, 2007·10 cites·17 claims
- 1586US6534852B1Ball grid array semiconductor package with improved strength and electric performance and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 18, 2003·55 cites·10 claims
- 1685US6768207B2Multichip wafer-level package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 27, 2004·44 cites·11 claims
- 1783US7129583B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 31, 2006·22 cites·4 claims
- 1883US6211574B1Semiconductor package with wire protection and method thereforADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Apr 3, 2001·71 cites·9 claims
- 1981US7141867B2Quad flat non-leaded packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Nov 28, 2006·10 cites·15 claims
- 2081US6864168B2Bump and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 8, 2005·25 cites·9 claims
- 2181US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 2281US6528393B2Method of making a semiconductor package by dicing a wafer from the backside surface thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·30 cites·31 claims
- 2381US6204559B1Ball grid assembly type semiconductor package having improved chip edge support to prevent chip crackingADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Mar 20, 2001·71 cites·10 claims
- 2480US6819002B2Under-ball-metallurgy layerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 16, 2004·28 cites·19 claims
- 2580US5474433AAxial sealing mechanism of volute compressorIND TECH RES INST·Filed 1994·Granted Dec 12, 1995·40 cites·11 claims
- 2677US6838762B2Water-level package with bump ringADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 4, 2005·24 cites·16 claims
- 2776US6693364B2Optical integrated circuit element package and process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·23 cites·14 claims
- 2875US6201299B1Substrate structure of BGA semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Mar 13, 2001·47 cites·8 claims
- 2975US6135522ASucker for transferring packaged semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Oct 24, 2000·44 cites·3 claims
- 3074US7009302B2Micromachine package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 7, 2006·19 cites·11 claims
- 3173US7002257B2Optical component package and packaging including an optical component horizontally attached to a substrateADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 21, 2006·19 cites·20 claims
- 3272US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 3372US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 3472US6348729B1Semiconductor chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 19, 2002·42 cites·10 claims
- 3572US6265768B1Chip scale packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 24, 2001·19 cites·14 claims
- 3670US6933605B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 23, 2005·14 cites·7 claims
- 3769US6946729B2Wafer level package structure with a heat slugADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 20, 2005·15 cites·9 claims
- 3869US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 3969US6768332B2Semiconductor wafer and testing method for the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 27, 2004·16 cites·14 claims
- 4068US6093960ASemiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performanceADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jul 25, 2000·43 cites·3 claims
- 4164US7253529B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·7 cites·12 claims
- 4262US7473581B2Wafer stacking package methodADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jan 6, 2009·2 cites·20 claims
- 4362US6316828B1Structure of a solder mask for the circuit module of a BGA substrateADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 13, 2001·27 cites·18 claims
- 4462US6161753AMethod of making a low-profile wire connection for stacked diesADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Dec 19, 2000·28 cites·4 claims
- 4561US6610924B1Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Aug 26, 2003·10 cites·14 claims
- 4661US6573123B2Semiconductor chip package and manufacturing method thereofFiled 2001·Granted Jun 3, 2003·11 cites·16 claims
- 4760US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 4860US6048184ABack-pressure sealing system for revolving compressorIND TECH RES INST·Filed 1997·Granted Apr 11, 2000·16 cites·8 claims
- 4959US7037759B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 2, 2006·7 cites·16 claims
- 5057US6153939AFlip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the sameADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 28, 2000·22 cites·6 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →