Inventor · disambiguated record
Susan C. Trulli
Also filed as: TRULLI SUSAN C
21 granted patents·7 pending applications·136 citations·filing 2003–2023
94Inventor score
Top patents by PatentIndex Score
28 records- 0195US6872909B2Toroidal low-field reactive gas and plasma source having a dielectric vacuum vesselAPPLIED SCIENCE & TECH INC·Filed 2003·Granted Mar 29, 2005·55 cites·10 claims
- 0293US7501600B2Toroidal low-field reactive gas and plasma source having a dielectric vacuum vesselMKS INSTR INC·Filed 2005·Granted Mar 10, 2009·17 cites·25 claims
- 0391US9978698B1Interconnect structure for electrical connecting a pair of microwave transmission lines formed on a pair of spaced structure membersRAYTHEON CO·Filed 2017·Granted May 22, 2018·9 cites·19 claims
- 0490US7659489B2Toroidal low-field reactive gas and plasma source having a dielectric vacuum vesselMKS INSTR INC·Filed 2007·Granted Feb 9, 2010·13 cites·34 claims
- 0587US10232582B2Anisotropic thermal conduitRAYTHEON CO·Filed 2018·Granted Mar 19, 2019·4 cites·25 claims
- 0687US9318450B1Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)RAYTHEON CO·Filed 2014·Granted Apr 19, 2016·10 cites·7 claims
- 0786US10321555B1Printed circuit board based RF circuit moduleRAYTHEON CO·Filed 2018·Granted Jun 11, 2019·5 cites·12 claims
- 0885US9889624B2Anisotropic thermal conduitRAYTHEON CO·Filed 2015·Granted Feb 13, 2018·4 cites·25 claims
- 0984US10709011B2Radio frequency (RF) shielding structure for RF connector to microwave transmission interconnect regions and methods for manufacturing such RF shielding structureRAYTHEON CO·Filed 2018·Granted Jul 7, 2020·4 cites·27 claims
- 1081US10218045B2Serially connected transmission line sections each having a conductive shield member overlying a portion of a strip conductorRAYTHEON CO·Filed 2017·Granted Feb 26, 2019·3 cites·26 claims
- 1180US11476178B2Selectively-pliable chemical vapor deposition (CVD) diamond or other heat spreaderRAYTHEON CO·Filed 2020·Granted Oct 18, 2022·1 cites·20 claims
- 1280US10785863B2Circuit support and cooling structureRAYTHEON CO·Filed 2018·Granted Sep 22, 2020·3 cites·5 claims
- 1376US11152279B2Monolithic microwave integrated circuit (MMIC) cooling structureRAYTHEON CO·Filed 2018·Granted Oct 19, 2021·2 cites·41 claims
- 1475US10243246B2Phase shifter including a branchline coupler having phase adjusting sections formed by connectable conductive padsRAYTHEON CO·Filed 2017·Granted Mar 26, 2019·2 cites·4 claims
- 1572US10276282B2Coaxial transmission line structureRAYTHEON CO·Filed 2017·Granted Apr 30, 2019·1 cites·21 claims
- 1665US8653673B2Method for packaging semiconductors at a wafer levelHALLOCK ROBERT B·Filed 2011·Granted Feb 18, 2014·3 cites·20 claims
- 1765US2025145845A1Aerosol-jettable silver nanoparticle-based convertible inkRAYTHEON CO·Filed 2023·Application pending·0 cites
- 1856US11710708B2On-chip EMF isolation of an integrated circuit coupled with photoconductive semiconductor switch under an on-chip faraday cageRAYTHEON CO·Filed 2021·Granted Jul 25, 2023·0 cites·19 claims
- 1956US2023332003A1Low-k and low dielectric loss dielectric composition for aerosol jet printingRAYTHEON CO·Filed 2023·Application pending·0 cites
- 2053US2024002692A1Direct write dual cure gasketRAYTHEON CO·Filed 2023·Application pending·0 cites
- 2150US11406007B2Radio frequency (RF) energy transmission line transition structureRAYTHEON CO·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 2248US2025063672A1Real-time in-situ additive circuit tuning for rf/microwave electronicsRAYTHEON CO·Filed 2023·Application pending·0 cites
- 2345US11146223B2High power radio frequency (RF) amplifiersRAYTHEON CO·Filed 2019·Granted Oct 12, 2021·0 cites·8 claims
- 2444US10374280B2Quadrature couplerRAYTHEON CO·Filed 2017·Granted Aug 6, 2019·0 cites·18 claims
- 2540US10511076B2RF coupler including vertically stacked coupling sections having conductive layers disposed between the coupling sections and the coupler including a surrounding electric shieldRAYTHEON CO·Filed 2017·Granted Dec 17, 2019·0 cites·13 claims
- 2638US2007272299A1Methods and apparatus for downstream dissociation of gasesMKS INSTR INC·Filed 2006·Application pending·0 cites
- 2736US2008308922A1Method for packaging semiconductors at a wafer levelZHANG YIWEN·Filed 2007·Application pending·0 cites
- 2833US2016276242A1Thermal spreader having inter-metal diffusion barrier layerRAYTHEON CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →