Inventor · disambiguated record
Sunil Wickramanayaka
Also filed as: WICKRAMANAYAKA SUNIL
18 granted patents·10 pending applications·300 citations·filing 1996–2019
94Inventor score
Files withCANON ANELVA CORP12ANELVA CORP8AGENCY SCIENCE TECH & RES6SUZUKI MOTOR CO1WICKRAMANAYAKA SUNIL1
Top patents by PatentIndex Score
28 records- 0196US6462482B1Plasma processing system for sputter deposition applicationsANELVA CORP·Filed 2000·Granted Oct 8, 2002·87 cites·13 claims
- 0292US7159537B2Device for fixing a gas showerhead or target plate to an electrode in plasma processing systemsANELVA CORP·Filed 2004·Granted Jan 9, 2007·54 cites·27 claims
- 0390US7848077B2Electrostatic chuck deviceCANON ANELVA CORP·Filed 2009·Granted Dec 7, 2010·10 cites·3 claims
- 0486US7791857B2Electrostatic chuck deviceCANON ANELVA CORP·Filed 2008·Granted Sep 7, 2010·7 cites·6 claims
- 0586US7623334B2Electrostatic chuck deviceCANON ANELVA CORP·Filed 2003·Granted Nov 24, 2009·25 cites·10 claims
- 0685US6225746B1Plasma processing systemANELVA CORP·Filed 2000·Granted May 1, 2001·25 cites·18 claims
- 0782US7724493B2Electrostatic chuck deviceCANON ANELVA CORP·Filed 2008·Granted May 25, 2010·5 cites·17 claims
- 0880US6333601B1Planar gas introducing unit of a CCP reactorANELVA CORP·Filed 2000·Granted Dec 25, 2001·25 cites·27 claims
- 0978US6216632B1Plasma processing systemANELVA CORP·Filed 1999·Granted Apr 17, 2001·32 cites·15 claims
- 1077US10249593B2Method for bonding a chip to a waferAGENCY SCIENCE TECH & RES·Filed 2015·Granted Apr 2, 2019·4 cites·8 claims
- 1175US7816283B2Method of depositing a higher permittivity dielectric filmCANON ANELVA CORP·Filed 2005·Granted Oct 19, 2010·4 cites·11 claims
- 1273US7625472B2Plasma-assisted sputter deposition systemCANON ANELVA CORP·Filed 2005·Granted Dec 1, 2009·3 cites·13 claims
- 1373US7164571B2Wafer stage with a magnetANELVA CORP·Filed 2005·Granted Jan 16, 2007·5 cites·17 claims
- 1469US2009178917A1Method of sputtering a high-k dielectric materialCANON ANELVA CORP·Filed 2009·Application pending·0 cites
- 1569US2009178920A1Multi-cathode ionized physical vapor deposition systemCANON ANELVA CORP·Filed 2009·Application pending·0 cites
- 1669US2009194413A1Multi-cathode ionized physical vapor deposition systemCANON ANELVA CORP·Filed 2009·Application pending·0 cites
- 1765US8986522B2Angled sputtering physical vapor deposition apparatus with wafer holder and wafer holder for an angled sputtering physical vapor deposition apparatusWICKRAMANAYAKA SUNIL·Filed 2011·Granted Mar 24, 2015·2 cites·7 claims
- 1863US2009194412A1Multi-cathode ionized physical vapor deposition systemCANON ANELVA CORP·Filed 2009·Application pending·0 cites
- 1955US2009218217A1Sputtering apparatus for depositing a higher permittivity dielectric filmCANON ANELVA CORP·Filed 2009·Application pending·0 cites
- 2053US2006158823A1Electrostatic chuck deviceANELVA CORP·Filed 2006·Application pending·0 cites
- 2152US2005115827A1Multi-cathode ionized physical vapor deposition systemANELVA CORP·Filed 2004·Application pending·0 cites
- 2250US9613928B2Method and apparatus for chip-to-wafer integrationAGENCY SCIENCE TECH & RES·Filed 2014·Granted Apr 4, 2017·0 cites·18 claims
- 2348US2006281314A1Wafer Holder And Method Of Holding A WaferCANON ANELVA CORP·Filed 2006·Application pending·0 cites
- 2444US5962083AMethods of depositing films on polymer substratesSUZUKI MOTOR CO·Filed 1996·Granted Oct 5, 1999·12 cites·8 claims
- 2542US11508619B2Electrical connection structure and method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2019·Granted Nov 22, 2022·0 cites·13 claims
- 2638US10134607B2Method for low temperature bonding of wafersAGENCY SCIENCE TECH & RES·Filed 2015·Granted Nov 20, 2018·0 cites·14 claims
- 2734US2017309584A1Method of bonding a first substrate and a second substrateAGENCY SCIENCE TECH & RES·Filed 2015·Application pending·0 cites
- 2832US2019031502A1SEAL RING FOR AL-Ge BONDINGAGENCY SCIENCE TECH & RES·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →