Inventor · disambiguated record
Swee Kwang Chua
Also filed as: CHUA SWEE KWANG
28 granted patents·1 pending application·779 citations·filing 2002–2013
97Inventor score
Technology areasH10W
Top patents by PatentIndex Score
29 records- 0198US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0297US6882021B2Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a leadMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·157 cites·38 claims
- 0396US7193312B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·32 cites·13 claims
- 0494US8106488B2Wafer level packagingCHUA SWEE KWANG·Filed 2010·Granted Jan 31, 2012·18 cites·18 claims
- 0593US8065792B2Method for packaging circuitsCHIA YONG POO·Filed 2010·Granted Nov 29, 2011·13 cites·18 claims
- 0693US7820484B2Wafer level packagingMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·20 cites·48 claims
- 0792US7375009B2Method of forming a conductive via through a waferMICRON TECHNOLOGY INC·Filed 2002·Granted May 20, 2008·51 cites·35 claims
- 0892US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 0991US7863722B2Stackable semiconductor assemblies and methods of manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2008·Granted Jan 4, 2011·17 cites·30 claims
- 1091US7173330B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 6, 2007·17 cites·21 claims
- 1190US7674655B2Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding materialMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·15 cites·24 claims
- 1290US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 1387US8555495B2Method for packaging circuitsCHIA YONG POO·Filed 2011·Granted Oct 15, 2013·6 cites·20 claims
- 1487US7274094B2Leadless packaging for image sensor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 25, 2007·39 cites·24 claims
- 1586US7712211B2Method for packaging circuits and packaged circuitsMICRON TECHNOLOGY INC·Filed 2003·Granted May 11, 2010·26 cites·25 claims
- 1686US6958537B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·32 cites·18 claims
- 1784US6987031B2Multiple chip semiconductor package and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 17, 2006·27 cites·32 claims
- 1883US7915711B2Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor dieMICRON TECHNOLOGY INC·Filed 2010·Granted Mar 29, 2011·5 cites·19 claims
- 1982US7816750B2Thin semiconductor die packages and associated systems and methodsAPTINA IMAGING CORP·Filed 2007·Granted Oct 19, 2010·11 cites·15 claims
- 2082US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 2181US7112471B2Leadless packaging for image sensor devices and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·27 cites·26 claims
- 2279US7304375B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 4, 2007·5 cites·12 claims
- 2378US8564106B2Wafer level packagingCHUA SWEE KWANG·Filed 2012·Granted Oct 22, 2013·3 cites·20 claims
- 2462US7553697B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·1 cites·16 claims
- 2556US8669657B2Stackable semiconductor assemblies and methods of manufacturing such assembliesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 11, 2014·0 cites·6 claims
- 2653US8518747B2Stackable semiconductor assemblies and methods of manufacturing such assembliesCHUA SWEE KWANG·Filed 2012·Granted Aug 27, 2013·0 cites·9 claims
- 2751US8362594B2Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold materialMICRON TECHNOLOGY INC·Filed 2011·Granted Jan 29, 2013·0 cites·19 claims
- 2850US8288874B2Stackable semiconductor assemblies and methods of manufacturing such assembliesCHUA SWEE KWANG·Filed 2010·Granted Oct 16, 2012·0 cites·8 claims
- 2943US2004229400A1Multichip wafer level system packages and methods of forming sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →