Inventor · disambiguated record
Syuzo Aoki
Also filed as: AOKI SYUZO
8 granted patents·2 pending applications·49 citations·filing 2006–2016
85Inventor score
Top patents by PatentIndex Score
10 records- 0189US9933822B2Electronic component case and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Apr 3, 2018·10 cites·4 claims
- 0286US9920232B2Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating componentSHINKO ELECTRIC IND CO·Filed 2015·Granted Mar 20, 2018·3 cites·9 claims
- 0383US7483273B2Semiconductor module and semiconductor module heat radiation plateSHINKO ELECTRIC IND CO·Filed 2006·Granted Jan 27, 2009·15 cites·12 claims
- 0482US9332659B2Electronic component case and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted May 3, 2016·5 cites·5 claims
- 0579US9101981B2Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating componentAOKI SYUZO·Filed 2011·Granted Aug 11, 2015·4 cites·8 claims
- 0675US8213182B2Housing case for housing electronic circuit board, and electronic apparatusAOKI SYUZO·Filed 2009·Granted Jul 3, 2012·10 cites·10 claims
- 0772US9476138B2Composite plating liquidSUWA YORIYUKI·Filed 2012·Granted Oct 25, 2016·1 cites·5 claims
- 0856US9136200B2Heat radiating component and method of producing sameSUWA YORIYUKI·Filed 2011·Granted Sep 15, 2015·1 cites·6 claims
- 0940US2014034282A1Heat radiation component and method for manufacturing heat radiation componentSHINKO ELECTRIC IND CO·Filed 2013·Application pending·0 cites
- 1037US2011127013A1Heat-radiating component and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →