Inventor · disambiguated record
Tao Cheng
Also filed as: CHENG TAO · CHENG TAO-HUA
50 granted patents·16 pending applications·518 citations·filing 1995–2023
98Inventor score
Top patents by PatentIndex Score
66 records- 0196US9597752B2Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2015·Granted Mar 21, 2017·7 cites·20 claims
- 0294US11644872B2Portable electronic devicePEGATRON CORP·Filed 2021·Granted May 9, 2023·4 cites·16 claims
- 0394US5631793ACapacitor-couple electrostatic discharge protection circuitWINBOND ELECTRONICS CORP·Filed 1995·Granted May 20, 1997·142 cites·11 claims
- 0493US11353925B2Portable electronic devicePEGATRON CORP·Filed 2021·Granted Jun 7, 2022·4 cites·10 claims
- 0593US9908203B2Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2017·Granted Mar 6, 2018·4 cites·18 claims
- 0693US9761534B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Sep 12, 2017·11 cites·19 claims
- 0791US7897995B2Lateral bipolar junction transistor with reduced base resistanceMEDIATEK INC·Filed 2009·Granted Mar 1, 2011·21 cites·17 claims
- 0890US11373957B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2020·Granted Jun 28, 2022·2 cites·12 claims
- 0990US9779880B2Resin composition and dielectric layer and capacitor produced therefrom3M INNOVATIVE PROPERTIES CO·Filed 2016·Granted Oct 3, 2017·4 cites·16 claims
- 1090US7667302B1Integrated circuit chip with seal ring structureMEDIATEK INC·Filed 2008·Granted Feb 23, 2010·23 cites·14 claims
- 1189US7821038B2Power and ground routing of integrated circuit devices with improved IR drop and chip performanceMEDIATEK INC·Filed 2008·Granted Oct 26, 2010·18 cites·6 claims
- 1289US7671469B2SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effectMEDIATEK INC·Filed 2007·Granted Mar 2, 2010·16 cites·13 claims
- 1387US6492208B1Embedded SCR protection device for output and input padTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Dec 10, 2002·38 cites·11 claims
- 1485US6576934B2Embedded SCR protection device for output and input padTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 10, 2003·34 cites·11 claims
- 1583US8242586B2Integrated circuit chip with seal ring structureCHANG TIEN-CHANG·Filed 2009·Granted Aug 14, 2012·12 cites·16 claims
- 1682US8138616B2Bond pad structureCHANG TIEN-CHANG·Filed 2008·Granted Mar 20, 2012·12 cites·22 claims
- 1780US10784206B2Semiconductor packageMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·2 cites·17 claims
- 1880US9698102B2Power and ground routing of integrated circuit devices with improved IR drop and chip performanceMEDIATEK INC·Filed 2016·Granted Jul 4, 2017·3 cites·18 claims
- 1977US9881902B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Jan 30, 2018·2 cites·22 claims
- 2076US9905515B2Integrated circuit stress releasing structureMEDIATEK INC·Filed 2015·Granted Feb 27, 2018·3 cites·7 claims
- 2175US11837552B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2022·Granted Dec 5, 2023·0 cites·19 claims
- 2274US8860544B2Integrated inductorKO CHING-CHUNG·Filed 2009·Granted Oct 14, 2014·6 cites·8 claims
- 2374US7491584B2ESD protection device in high voltage and manufacturing method for the sameMEDIATEK INC·Filed 2005·Granted Feb 17, 2009·6 cites·17 claims
- 2473US8120067B1Power and ground routing of integrated circuit devices with improved IR drop and chip performanceKO CHING-CHUNG·Filed 2011·Granted Feb 21, 2012·3 cites·9 claims
- 2573US7894170B2ESD protection deviceMEDIATEK INC·Filed 2005·Granted Feb 22, 2011·6 cites·6 claims
- 2673US6465308B1Tunable threshold voltage of a thick field oxide ESD protection device with a N-field implantTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 15, 2002·17 cites·10 claims
- 2772US8072004B2Power and ground routing of integrated circuit devices with improved IR drop and chip performanceKO CHING-CHUNG·Filed 2010·Granted Dec 6, 2011·3 cites·11 claims
- 2871US10354974B2Structure and formation method of chip package structureMEDIATEK INC·Filed 2015·Granted Jul 16, 2019·2 cites·17 claims
- 2971US6611028B2Dynamic substrate-coupled electrostatic discharging protection circuitTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 26, 2003·14 cites·13 claims
- 3070US10186488B2Manufacturing method of semiconductor package and manufacturing method of semiconductor deviceMEDIATEK INC·Filed 2017·Granted Jan 22, 2019·1 cites·20 claims
- 3170US6940108B2Slot design for metal interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 6, 2005·23 cites·60 claims
- 3269US9455088B2Resin composition and dielectric layer and capacitor produced therefromCHENG TAO·Filed 2011·Granted Sep 27, 2016·1 cites·20 claims
- 3368US9379059B2Power and ground routing of integrated circuit devices with improved IR drop and chip performanceKO CHING-CHUNG·Filed 2011·Granted Jun 28, 2016·2 cites·6 claims
- 3468US6531382B1Use of a capping layer to reduce particle evolution during sputter pre-clean proceduresTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 11, 2003·16 cites·22 claims
- 3564US9198281B2Leadframe for semiconductor packagesMEDIATEK INC·Filed 2013·Granted Nov 24, 2015·1 cites·16 claims
- 3663US7532446B2Protection circuit for electro static dischargeMEDIATEK INC·Filed 2004·Granted May 12, 2009·11 cites·12 claims
- 3763US6479872B1Dynamic substrate-coupled electrostatic discharging protection circuitTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Nov 12, 2002·19 cites·9 claims
- 3861US7880234B2NPN Darlington ESD protection circuitMEDIATEK INC·Filed 2006·Granted Feb 1, 2011·2 cites·14 claims
- 3960US2024420157A1Metering abnormality analysis method and apparatus, storage medium, and computer deviceState Grid Chongqing Electric Power Company Marketing Service Center·Filed 2023·Application pending·0 cites
- 4059US7203050B2NPN Darlington ESD protection circuitMEDIATEK INC·Filed 2003·Granted Apr 10, 2007·8 cites·10 claims
- 4157US10879759B2Stator assembly and stepper drive motor including sameCONTINENTAL AUTOMOTIVE GMBH·Filed 2018·Granted Dec 29, 2020·0 cites·24 claims
- 4256US8587056B2High-voltage metal-oxide-semiconductor deviceLEE MING-CHENG·Filed 2012·Granted Nov 19, 2013·1 cites·8 claims
- 4356US6717220B2Tunable threshold voltage of a thick field oxide ESD protection device with a N-field implantTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 6, 2004·6 cites·15 claims
- 4455US10312222B2Semiconductor package and semiconductor device using the sameMEDIATEK INC·Filed 2017·Granted Jun 4, 2019·0 cites·20 claims
- 4555US8023237B2ESD protection circuit and method thereofMEDIATEK INC·Filed 2008·Granted Sep 20, 2011·2 cites·9 claims
- 4653US10002833B2Power and ground routing of integrated circuit devices with improved IR drop and chip performanceMEDIATEK INC·Filed 2017·Granted Jun 19, 2018·0 cites·20 claims
- 4750US8044466B2ESD protection device in high voltage and manufacturing method for the sameMEDIATEK INC·Filed 2009·Granted Oct 25, 2011·0 cites·11 claims
- 4850US2024282208A1Electronic device and display method for video conference or video teachingPEGATRON CORP·Filed 2023·Application pending·0 cites
- 4950US2010044833A1Integrated capacitorCHENG TAO·Filed 2008·Application pending·0 cites
- 5049US2007096269A1Leadframe for semiconductor packagesMEDIATEK INC·Filed 2006·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →