Inventor · disambiguated record
Takahiro Daikoku
Also filed as: DAIKOKU TAKAHIRO · HIRASAWA SHIGEKI · KUWAHARA HEIKICHI
61 granted patents·3 pending applications·3,682 citations·filing 1977–2025
99Inventor score
Top patents by PatentIndex Score
64 records- 0198US10421299B2Sheet supplying apparatus and printing apparatusCANON KK·Filed 2018·Granted Sep 24, 2019·17 cites·14 claims
- 0297US5077601ACooling system for cooling an electronic device and heat radiation fin for use in the cooling systemHITACHI LTD·Filed 1989·Granted Dec 31, 1991·204 cites·7 claims
- 0396US6351384B1Device and method for cooling multi-chip modulesHITACHI LTD·Filed 2000·Granted Feb 26, 2002·322 cites·15 claims
- 0496US5349831AApparatus for cooling heat generating membersHITACHI LTD·Filed 1992·Granted Sep 27, 1994·227 cites·7 claims
- 0595US4558395ACooling module for integrated circuit chipsHITACHI LTD·Filed 1984·Granted Dec 10, 1985·97 cites·17 claims
- 0694US5592363AElectronic apparatusHITACHI LTD·Filed 1993·Granted Jan 7, 1997·228 cites·10 claims
- 0794US5270572ALiquid impingement cooling module for semiconductor devicesHITACHI LTD·Filed 1992·Granted Dec 14, 1993·188 cites·24 claims
- 0893US5934368AAir-cooled electronic apparatus with condensation preventionHITACHI LTD·Filed 1995·Granted Aug 10, 1999·155 cites·7 claims
- 0993US5689572AMethod of actively controlling noise, and apparatus thereofHITACHI LTD·Filed 1994·Granted Nov 18, 1997·123 cites·44 claims
- 1093US5345107ACooling apparatus for electronic deviceHITACHI LTD·Filed 1992·Granted Sep 6, 1994·157 cites·45 claims
- 1191US6528878B1Device for sealing and cooling multi-chip modulesHITACHI LTD·Filed 2000·Granted Mar 4, 2003·72 cites·11 claims
- 1291US4897762ACooling system and method for electronic circuit devicesHITACHI LTD·Filed 1988·Granted Jan 30, 1990·102 cites·7 claims
- 1390US5818694ACooling apparatus for electronic devicesHITACHI LTD·Filed 1997·Granted Oct 6, 1998·118 cites·14 claims
- 1490US4770242ACooling device of semiconductor chipsHITACHI LTD·Filed 1986·Granted Sep 13, 1988·96 cites·4 claims
- 1589US5365400AHeat sinks and semiconductor cooling device using the heat sinksHITACHI LTD·Filed 1991·Granted Nov 15, 1994·119 cites·6 claims
- 1687US4649990AHeat-conducting cooling moduleHITACHI LTD·Filed 1985·Granted Mar 17, 1987·75 cites·12 claims
- 1786US5774334ALow thermal resistant, fluid-cooled semiconductor moduleHITACHI LTD·Filed 1995·Granted Jun 30, 1998·89 cites·15 claims
- 1886US5705850ASemiconductor moduleHITACHI LTD·Filed 1994·Granted Jan 6, 1998·89 cites·15 claims
- 1985US4166498AVapor-condensing, heat-transfer wallHITACHI CABLE·Filed 1977·Granted Sep 4, 1979·42 cites·3 claims
- 2084US4520866AFalling film evaporation type heat exchangerHITACHI LTD·Filed 1983·Granted Jun 4, 1985·46 cites·18 claims
- 2183US5751062ACooling device of multi-chip moduleHITACHI LTD·Filed 1995·Granted May 12, 1998·75 cites·14 claims
- 2283US5089936ASemiconductor moduleHITACHI LTD·Filed 1989·Granted Feb 18, 1992·64 cites·20 claims
- 2383US4602681AHeat transfer surface with multiple layersHITACHI LTD & HITACHI CABLE LT·Filed 1983·Granted Jul 29, 1986·43 cites·3 claims
- 2482US5058389AFluid temperature control system and computer system using sameHITACHI LTD·Filed 1990·Granted Oct 22, 1991·55 cites·23 claims
- 2582US4823863AThermal conduction deviceHITACHI LTD·Filed 1987·Granted Apr 25, 1989·53 cites·6 claims
- 2681US6890799B2Device for sealing and cooling multi-chip modulesHITACHI LTD·Filed 2003·Granted May 10, 2005·30 cites·10 claims
- 2780US6632780B2Highly thermal conductive grease composition and cooling device using the sameHITACHI LTD·Filed 2001·Granted Oct 14, 2003·16 cites·7 claims
- 2880US5515912ACooling apparatus of electronic devicesHITACHI LTD·Filed 1991·Granted May 14, 1996·58 cites·14 claims
- 2980US5276586ABonding structure of thermal conductive members for a multi-chip moduleHITACHI LTD·Filed 1992·Granted Jan 4, 1994·69 cites·11 claims
- 3080US2025242616A1Carriage apparatus, printing apparatus, and control method thereofCANON KK·Filed 2025·Application pending·0 cites
- 3179US5126829ACooling apparatus for electronic deviceHITACHI LTD·Filed 1989·Granted Jun 30, 1992·52 cites·17 claims
- 3279US4363012AWinding structure for static electrical induction apparatusHITACHI LTD·Filed 1980·Granted Dec 7, 1982·19 cites·13 claims
- 3377US4532770AMagnetic refrigeratorHITACHI LTD·Filed 1984·Granted Aug 6, 1985·30 cites·4 claims
- 3476US5047837ASemiconductor device with heat transfer capHITACHI LTD·Filed 1989·Granted Sep 10, 1991·46 cites·4 claims
- 3574US5133403ACooling arrangement for semiconductor devices and method of making the sameHITACHI LTD·Filed 1989·Granted Jul 28, 1992·44 cites·42 claims
- 3674US4956043ADry etching apparatusHITACHI LTD·Filed 1988·Granted Sep 11, 1990·46 cites·22 claims
- 3773US6711017B2Cooling apparatus for electronic unitHITACHI INT ELECTRIC INC·Filed 2002·Granted Mar 23, 2004·25 cites·21 claims
- 3873US4245206AWinding structure for static electrical induction apparatusHITACHI LTD·Filed 1978·Granted Jan 13, 1981·14 cites·18 claims
- 3972US4678029AEvaporating heat transfer wallHITACHI CABLE·Filed 1984·Granted Jul 7, 1987·28 cites·19 claims
- 4071US4207550AWinding structure of electric devicesHITACHI LTD·Filed 1978·Granted Jun 10, 1980·24 cites·9 claims
- 4171US2022097427A1Carriage apparatus, printing apparatus, and control method thereofCANON KK·Filed 2021·Application pending·0 cites
- 4270US10532401B2Liquid-cooling cold plate and method for manufacturing sameHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 14, 2020·2 cites·2 claims
- 4370US4606405AHeat transfer wallHITACHI LTD·Filed 1985·Granted Aug 19, 1986·31 cites·1 claims
- 4469US11044838B2Railway equipment inspecting and measuring apparatus, and railway equipment inspecting and measuring methodHITACHI HIGH TECH FINE SYSTEMS CORP·Filed 2019·Granted Jun 22, 2021·2 cites·7 claims
- 4569US4457135AMagnetic refrigerating apparatusHITACHI LTD·Filed 1983·Granted Jul 3, 1984·24 cites·6 claims
- 4668US4195688AHeat-transfer wall for condensation and method of manufacturing the sameHITACHI CABLE·Filed 1978·Granted Apr 1, 1980·24 cites·6 claims
- 4767USRE35721ECooling device of semiconductor chipsHITACHI LTD·Filed 1989·Granted Feb 3, 1998·33 cites·4 claims
- 4866US7518233B1Sealing structure for multi-chip moduleHITACHI LTD·Filed 2000·Granted Apr 14, 2009·16 cites·4 claims
- 4965US4194384AMethod of manufacturing heat-transfer wall for vapor condensationHITACHI CABLE·Filed 1978·Granted Mar 25, 1980·17 cites·8 claims
- 5063US4298825AMagnetron deviceHITACHI LTD·Filed 1979·Granted Nov 3, 1981·9 cites·7 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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